LFE3-35EA-7FN672C

The LFE3-35EA-7FN672C is a Lattice Semiconductor ECP3 family FPGA offering approximately 33,000 logic elements and high I/O density in a 672-ball BGA package. It combines reconfigurable logic, embedded memory and DSP resources to address mid-range, high‑integration designs.

Targeted at applications requiring balanced logic, memory and serial/I/O capabilities, this commercial‑grade device delivers on-chip resources and flexible I/O in a compact surface‑mount footprint while operating from a low‑voltage core supply.

Key Features

• Logic Capacity  Approximately 33,000 logic elements suitable for mid-range system integration and glue‑logic functions.
• Embedded Memory  Approximately 1.36 Mbits of on‑chip RAM (total RAM bits: 1,358,848) for packet buffering, FIFOs and local data storage.
• DSP and Arithmetic Resources  ECP3 family sysDSP architecture with numerous 18×18 multipliers (device-level support: 64 18×18 multipliers) for efficient multiply–accumulate operations and signal processing tasks.
• High‑Speed Serial and I/O Support  Family supports embedded SERDES with data rates up to 3.2 Gbps and a wide range of programmable I/O standards; this device provides 310 user I/Os for dense peripheral and bus interfaces.
• Clocking and Timing  Device-level PLLs and DLLs (4 PLLs / 2 DLLs) to support multiple clock domains and precise timing control.
• Flexible Configuration  ECP3 family configuration features including dual-boot and SPI boot flash interface support (family-level capabilities described in datasheet).
• Power and Package  Low-voltage core supply (1.14 V to 1.26 V), commercial temperature range (0 °C to 85 °C), surface mount 672‑BBGA package (supplier package: 672‑FPBGA, 27 × 27 mm).
• Compliance  RoHS compliant for environmental compatibility in standard commercial applications.

Typical Applications

• Networking & Communications  Use as a protocol bridge, packet processor or serial interface engine leveraging high I/O count and family SERDES support.
• Video and Broadcast I/O  On‑chip memory and DSP resources can be used for buffering, timing and signal conditioning in video transport or formatting functions.
• High‑speed Data Acquisition  Combine sysDSP multipliers and embedded RAM for front‑end data processing, filtering and local storage.
• Embedded System Integration  Deploy as a mid‑range FPGA to consolidate glue logic, peripheral interfaces and custom control in compact, surface‑mount designs.

Unique Advantages

• Balanced integration: Approximately 33K logic elements paired with ~1.36 Mbits of embedded memory delivers the right mix of logic and storage for mid-sized designs.
• High I/O density in a compact package: 310 user I/Os in a 672‑ball BGA (27 × 27 mm) enable numerous parallel and serial connections without a large board footprint.
• Hardware DSP capabilities: Device‑level 18×18 multipliers accelerate multiply–accumulate operations for signal processing and algorithm offload.
• Flexible clocking: Multiple PLLs and DLLs allow reliable handling of multiple clock domains and timing-critical interfaces.
• Low‑voltage core operation: 1.14–1.26 V supply supports modern low‑power system architectures and standard FPGA power rails.
• Commercial readiness: Surface mount packaging and RoHS compliance simplify integration into standard commercial products.

Why Choose LFE3-35EA-7FN672C?

This ECP3 device is positioned for designs that require a balanced, mid‑range FPGA: substantial logic capacity, meaningful on‑chip RAM and DSP resources, and a high I/O count in a compact surface‑mount package. Its family‑level features—such as high‑speed serial support, programmable I/O standards and flexible clocking—make it suitable for communications, data acquisition and embedded system integration where commercial temperature operation is sufficient.

For OEMs and designers seeking a compact FPGA solution that combines logic, memory and DSP blocks with flexible I/O and industry‑standard packaging, the LFE3-35EA-7FN672C offers a practical platform backed by Lattice ECP3 family capabilities.

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