LFE3-35EA-7LFN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA |
|---|---|
| Quantity | 273 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-7LFN484C – ECP3 Field Programmable Gate Array (FPGA), 33,000 logic elements, 295 I/Os
The LFE3-35EA-7LFN484C is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It integrates a substantial programmable logic array with embedded memory and a high count of general-purpose I/Os in a compact BGA package.
With 33,000 logic elements, approximately 1.36 Mbits of embedded memory, and 295 I/O pins, this device is suited for logic-dense, I/O-rich designs where compact package, low-voltage operation, and commercial-grade temperature support are important.
Key Features
- Core Capacity — 33,000 logic elements provide significant on-chip programmable logic resources for implementing complex digital functions.
- Embedded Memory — Approximately 1.36 Mbits (1,358,848 bits) of on-chip RAM to support data buffering, state storage, and small lookup tables.
- I/O Density — 295 I/O pins to support multiple parallel interfaces, external device control, and board-level system integration.
- Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V for compatibility with low-voltage system domains.
- Package and Mounting — Available in a 484-FPBGA (23×23) / 484-BBGA package and designed for surface-mount assembly to save PCB area.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant to meet standard environmental requirements.
Typical Applications
- Logic-dense digital prototypes — Use the 33,000 logic elements to implement and validate complex digital functions and subsystems.
- I/O-intensive interface bridging — 295 I/Os allow the FPGA to serve as a central hub for multiple parallel and serial connections.
- Memory-assisted processing — Approximately 1.36 Mbits of embedded RAM supports buffering, packet handling, and state machines within a single device.
- Compact board-level solutions — The 484-FPBGA (23×23) package and surface-mount mounting enable space-efficient PCB designs.
Unique Advantages
- High on-chip logic capacity: 33,000 logic elements reduce the need for external glue logic and simplify system partitioning.
- Substantial embedded memory: Approximately 1.36 Mbits of RAM supports local data storage and on-chip buffering to improve system responsiveness.
- Extensive I/O availability: 295 I/O pins provide flexibility for connecting sensors, peripherals, and multiple interfaces without additional chips.
- Compact BGA footprint: 484-FPBGA (23×23) packaging provides a high-pin-count solution in a board-area-efficient form factor.
- Low-voltage core operation: 1.14–1.26 V supply range aligns with modern low-voltage system designs.
- Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
Why Choose LFE3-35EA-7LFN484C?
The LFE3-35EA-7LFN484C positions itself as a high-capacity, I/O-rich FPGA option for commercial embedded designs that require a balance of programmable logic, on-chip memory, and a compact BGA package. Its combination of 33,000 logic elements, approximately 1.36 Mbits of embedded RAM, and 295 I/Os makes it suitable for system-level integration where board space and interface density matter.
Backed by Lattice Semiconductor as the manufacturer and delivered in a surface-mount 484-FPBGA package, this device offers a practical platform for designers seeking scalable logic resources, reliable commercial-temperature operation, and RoHS-compliant hardware.
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