LFE3-35EA-7LFN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA

Quantity 1,028 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells33000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1358848

Overview of LFE3-35EA-7LFN484I – ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA

The LFE3-35EA-7LFN484I is an ECP3 field programmable gate array (FPGA) from Lattice Semiconductor Corporation supplied in a 484-BBGA package. It provides a high count of programmable logic and on-chip memory with extensive I/O, packaged and specified for industrial operating conditions.

This FPGA is intended where a combination of logic capacity, embedded memory and a large I/O complement are required, and where operation across an industrial temperature range and low-voltage core operation are important design considerations.

Key Features

  • Core Logic: Approximately 33,000 logic elements and 4,125 logic blocks provide programmable logic capacity for custom digital designs.
  • Embedded Memory: Approximately 1.36 Mbits of on-chip RAM to support buffers, FIFOs and local data storage without external memory.
  • I/O Density: Up to 295 I/O pins to support wide peripheral connectivity and parallel interfaces.
  • Power Supply: Low-voltage core operation with a supply range of 1.14 V to 1.26 V, enabling designs optimized for power-sensitive applications.
  • Package & Mounting: 484-ball BBGA package (supplier package 484-FPBGA, 23×23) in a surface-mount form factor for dense board integration.
  • Operating Range: Industrial-grade temperature specification from −40 °C to 100 °C for deployment in demanding environments.
  • Compliance: RoHS compliant for regulatory and assembly compatibility.

Typical Applications

  • Industrial control systems: Industrial-grade temperature rating and high I/O count support control, monitoring and interface tasks in factory and process automation.
  • High-density I/O aggregation: Large I/O complement enables consolidation of multiple interfaces or peripheral buses onto a single FPGA device.
  • Embedded logic and buffering: Significant logic element count and approximately 1.36 Mbits of embedded RAM support custom protocol handling, buffering and local data processing.

Unique Advantages

  • High programmable capacity: ~33,000 logic elements deliver the resources needed for complex custom logic without external accelerators.
  • Substantial on-chip memory: Approximately 1.36 Mbits of RAM reduces dependence on external memory and simplifies board designs.
  • Extensive I/O: 295 I/O pins allow flexible interfacing to sensors, peripherals and high-pin-count connectors.
  • Industrial readiness: Specified for −40 °C to 100 °C operation, suitable for deployment in thermally challenging environments.
  • Compact, surface-mount package: 484-BBGA (484-FPBGA, 23×23) enables high-density PCB implementations while supporting robust solder mounting.
  • Low-voltage core operation: 1.14–1.26 V supply range supports low-power design strategies for constrained systems.

Why Choose LFE3-35EA-7LFN484I?

The LFE3-35EA-7LFN484I positions itself as a capable mid-range ECP3 FPGA option that balances programmable logic density, embedded memory and wide I/O in an industrial-grade package. Its combination of ~33,000 logic elements, roughly 1.36 Mbits of on-chip RAM and 295 I/Os supports integrated, compact designs that require significant local processing and interface flexibility.

Engineers designing for industrial applications or I/O-intensive embedded systems will find this device suited to consolidate functions, reduce external component count and operate across a wide temperature range. Manufactured by Lattice Semiconductor Corporation and supplied in a 484-BBGA surface-mount package, it offers a pragmatic choice for deployments needing programmable logic, embedded memory and robust operating conditions.

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