LFE3-35EA-7LFN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA |
|---|---|
| Quantity | 1,028 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-7LFN484I – ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA
The LFE3-35EA-7LFN484I is an ECP3 field programmable gate array (FPGA) from Lattice Semiconductor Corporation supplied in a 484-BBGA package. It provides a high count of programmable logic and on-chip memory with extensive I/O, packaged and specified for industrial operating conditions.
This FPGA is intended where a combination of logic capacity, embedded memory and a large I/O complement are required, and where operation across an industrial temperature range and low-voltage core operation are important design considerations.
Key Features
- Core Logic: Approximately 33,000 logic elements and 4,125 logic blocks provide programmable logic capacity for custom digital designs.
- Embedded Memory: Approximately 1.36 Mbits of on-chip RAM to support buffers, FIFOs and local data storage without external memory.
- I/O Density: Up to 295 I/O pins to support wide peripheral connectivity and parallel interfaces.
- Power Supply: Low-voltage core operation with a supply range of 1.14 V to 1.26 V, enabling designs optimized for power-sensitive applications.
- Package & Mounting: 484-ball BBGA package (supplier package 484-FPBGA, 23×23) in a surface-mount form factor for dense board integration.
- Operating Range: Industrial-grade temperature specification from −40 °C to 100 °C for deployment in demanding environments.
- Compliance: RoHS compliant for regulatory and assembly compatibility.
Typical Applications
- Industrial control systems: Industrial-grade temperature rating and high I/O count support control, monitoring and interface tasks in factory and process automation.
- High-density I/O aggregation: Large I/O complement enables consolidation of multiple interfaces or peripheral buses onto a single FPGA device.
- Embedded logic and buffering: Significant logic element count and approximately 1.36 Mbits of embedded RAM support custom protocol handling, buffering and local data processing.
Unique Advantages
- High programmable capacity: ~33,000 logic elements deliver the resources needed for complex custom logic without external accelerators.
- Substantial on-chip memory: Approximately 1.36 Mbits of RAM reduces dependence on external memory and simplifies board designs.
- Extensive I/O: 295 I/O pins allow flexible interfacing to sensors, peripherals and high-pin-count connectors.
- Industrial readiness: Specified for −40 °C to 100 °C operation, suitable for deployment in thermally challenging environments.
- Compact, surface-mount package: 484-BBGA (484-FPBGA, 23×23) enables high-density PCB implementations while supporting robust solder mounting.
- Low-voltage core operation: 1.14–1.26 V supply range supports low-power design strategies for constrained systems.
Why Choose LFE3-35EA-7LFN484I?
The LFE3-35EA-7LFN484I positions itself as a capable mid-range ECP3 FPGA option that balances programmable logic density, embedded memory and wide I/O in an industrial-grade package. Its combination of ~33,000 logic elements, roughly 1.36 Mbits of on-chip RAM and 295 I/Os supports integrated, compact designs that require significant local processing and interface flexibility.
Engineers designing for industrial applications or I/O-intensive embedded systems will find this device suited to consolidate functions, reduce external component count and operate across a wide temperature range. Manufactured by Lattice Semiconductor Corporation and supplied in a 484-BBGA surface-mount package, it offers a pragmatic choice for deployments needing programmable logic, embedded memory and robust operating conditions.
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