LFE3-35EA-7LFN672C

The LFE3-35EA-7LFN672C is an ECP3 family Field Programmable Gate Array (FPGA) designed for reconfigurable digital logic integration. It provides 33,000 logic elements, approximately 1.36 Mbits of embedded memory, and up to 310 I/O pins in a compact 672-ball BGA package for commercial-grade applications.

This FPGA targets designs that require substantial logic capacity and I/O density while operating within a 1.14 V to 1.26 V core supply range and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Architecture  ECP3 family FPGA architecture implemented in a single device offering reprogrammable logic resources.
• Logic Capacity  33,000 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 1.36 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O Density  Up to 310 I/O pins to support multi-channel interfaces and connectivity requirements.
• Power Supply  Core voltage range of 1.14 V to 1.26 V for compatibility with standard FPGA power architectures.
• Package & Mounting  672-ball BGA (supplier package: 672-FPBGA, 27×27) supplied in a surface-mount form factor to save board space.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C for mainstream electronic applications.
• RoHS Compliance  Device is RoHS-compliant for environmental regulatory alignment.

Typical Applications

• High-density I/O systems  Use the 310 I/O pins to implement multi-channel interface hubs, bridging, and protocol aggregation.
• Embedded logic and control  Deploy the 33,000 logic elements and on-chip RAM for custom control, state machines, and data path logic.
• Data buffering and processing  Leverage approximately 1.36 Mbits of embedded memory for packet buffering, FIFOs, and temporary data storage.

Unique Advantages

• Balanced logic and memory ratio: 33,000 logic elements paired with ~1.36 Mbits of RAM provides a practical balance for mid-density FPGA designs.
• High I/O capacity: 310 I/Os enable dense external connectivity without additional interface components.
• Compact, board-friendly package: 672-ball BGA (27×27 FPBGA) in a surface-mount package conserves PCB area while supporting high pin counts.
• Commercial temperature suitability: Rated for 0 °C to 85 °C to meet requirements of mainstream electronic products and consumer-facing equipment.
• Regulatory alignment: RoHS compliance supports environmentally conscious product development and procurement.

Why Choose LFE3-35EA-7LFN672C?

The LFE3-35EA-7LFN672C delivers a combination of substantial logic capacity, embedded memory, and high I/O count in a single commercial-grade FPGA package. Its specified voltage range and compact 672-BBGA footprint make it suitable for designs that need significant reprogrammable logic and connectivity while maintaining a small board presence.

This device is well suited for engineers and procurement teams seeking a mid-to-high-density FPGA solution with verifiable on-chip resources and standard commercial operating conditions. It provides a clear path for scalable designs that require integration of logic, memory, and multi-pin interfacing within a RoHS-compliant component offering.

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