LFE3-35EA-8FN484C

The LFE3-35EA-8FN484C is a commercial-grade ECP3 Field Programmable Gate Array (FPGA) in a 484-ball BGA package designed for system integration where moderate logic density, flexible I/O and on-chip memory are required. It combines a reconfigurable FPGA fabric with series-level features such as embedded DSP resources and high-speed serial support to address a range of communication, signal processing and control applications.

This device provides 33,000 logic elements, approximately 1.36 Mbits of embedded memory and 295 user I/Os in a compact surface-mount 484-FPBGA (23×23 mm) footprint, with a 1.14 V–1.26 V core supply and commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 33,000 logic elements suitable for mid-density FPGA designs and partitioning of control, glue logic and processing functions.
• Embedded Memory — Approximately 1.36 Mbits of on-chip RAM for buffering, small data stores and local FIFOs.
• I/O Density & Flexibility — 295 user I/Os with programmable sysI/O capabilities described for the ECP3 family, enabling a wide range of parallel and source-synchronous interfaces.
• High-speed Serial Support (Family-level) — ECP3 family SERDES capabilities include support for multi-Gbps serial links and common protocols; consult the family datasheet for channel and protocol options.
• DSP-oriented Architecture (Family-level) — Series sysDSP slice architecture provides multiply-accumulate resources and high-performance arithmetic building blocks for signal processing tasks.
• Supply & Thermal — Core supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
• Package & Mounting — 484-BBGA / 484-FPBGA (23×23 mm) surface-mount package for compact board designs.
• Compliance — RoHS compliant and designated as commercial grade.

Typical Applications

• High-speed Connectivity — Implementation of multi-gigabit serial interfaces and protocol bridging using the ECP3 family’s SERDES capabilities.
• Signal Processing — Use of sysDSP slices and on-chip RAM for filtering, FFTs and other DSP tasks in communications and instrumentation.
• Interface Bridging & Glue Logic — Mid-density logic and abundant I/Os support protocol translation, bus interfacing and control-plane functions.
• Memory and Timing Control — Source-synchronous I/O support and embedded RAM for driving DDR interfaces, ADC/DAC timing or data capture logic.

Unique Advantages

• Balanced Integration: 33,000 logic elements plus on-chip RAM deliver a balance of programmable logic and memory for combined control and data tasks, reducing external component count.
• High I/O Count: 295 user I/Os enable dense board-level connectivity and flexible pin assignment for mixed-signal and multi-interface designs.
• Compact Surface-Mount Package: 484-FPBGA (23×23 mm) footprint supports space-constrained PCBs while maintaining high I/O and logic resources.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for a wide range of standard commercial electronic products.
• Low-Voltage Core: 1.14 V–1.26 V core supply supports modern power architectures and helps minimize system power when paired with appropriate power management.
• Standards-ready Family Features: Leverages ECP3 family capabilities—such as programmable sysI/O, sysDSP and multi-Gbps SERDES modes—to accelerate implementation of common protocols and signal-processing functions.

Why Choose LFE3-35EA-8FN484C?

The LFE3-35EA-8FN484C positions itself as a practical mid-density FPGA choice for designs that require a mix of logic resources, flexible I/O and on-chip memory in a compact surface-mount package. Its combination of 33,000 logic elements, approximately 1.36 Mbits of embedded RAM and 295 I/Os enables designers to consolidate functions that otherwise would require multiple discrete devices.

This device is well suited for commercial applications needing reliable, reconfigurable logic with family-level support for DSP functions and high-speed serial interfaces. It offers a scalable option within the ECP3 family for development teams focused on integration, board-level density and efficient use of system power.

Request a quote or submit a parts inquiry today to get pricing and availability for LFE3-35EA-8FN484C.