LFE3-35EA-8FN672C

The LFE3-35EA-8FN672C is a Lattice ECP3 family field programmable gate array (FPGA) device in a 672-ball BGA package. It combines a mid-range logic capacity with substantial on-chip memory and high I/O density for cost-sensitive, high-volume embedded designs.

This device targets applications requiring flexible I/O, embedded memory, and DSP/serial connectivity support while operating from a 1.14 V to 1.26 V core supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — Approximately 33,000 logic elements (LUT-based fabric) suitable for mid-range integration and system consolidation.
• Embedded Memory — Total on-chip RAM of 1,358,848 bits, approximately 1.36 Mbits of embedded memory for buffers, FIFOs, and local storage.
• I/O Density — 310 user I/Os to support wide peripheral and parallel interface requirements in compact board layouts.
• SERDES and High-Speed I/O (family capability) — ECP3 family includes embedded SERDES and source-synchronous I/O support with data-rate capability described in the family datasheet for high-speed serial protocols and ADC/DAC interfaces.
• DSP Resources (family capability) — sysDSP slices and dedicated multipliers are part of the ECP3 family architecture for efficient multiply-accumulate and signal-processing tasks.
• Package and Mounting — 672-ball BGA (supplier package: 672-FPBGA, 27 × 27 mm) in a surface-mount format for compact system designs.
• Power and Temperature — Core supply range 1.14 V to 1.26 V; commercial operating range 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Networking & Telecommunications — Use the device's I/O density and family SERDES capabilities for protocol bridging, packet processing, or line interface functions.
• High-Speed Data Acquisition — On-chip memory and DSP resources support buffering and pre-processing of ADC/DAC streams and sensor data.
• Video & Broadcast Processing — Logic density and embedded memory enable video interface handling, framing, and intermediate processing blocks.
• Embedded System Integration — Combine peripheral control, custom logic, and memory interfaces to reduce external components and simplify BOM in mid-range embedded products.

Unique Advantages

• Balanced Logic and Memory — ~33k logic elements paired with ~1.36 Mbits of embedded RAM provide a practical balance for mid-level integration without excessive external memory.
• High I/O Count — 310 user I/Os enable multiple parallel interfaces and mixed-signal front-end connectivity on a single device.
• Compact, Surface-Mount Package — 672-ball FPBGA (27 × 27 mm) supports dense PCB layouts while maintaining thermal and routing characteristics suitable for embedded systems.
• Commercial Temperature Grade — 0 °C to 85 °C operating range aligns with standard commercial applications and environments.
• Low-Voltage Core — 1.14 V to 1.26 V supply requirement supports modern low-voltage power rails common in compact designs.
• RoHS Compliant — Meets regulatory requirements for lead-free manufacturing processes.

Why Choose LFE3-35EA-8FN672C?

The LFE3-35EA-8FN672C provides a practical combination of mid-range logic capacity, on-chip memory, and high I/O count in a compact 672-ball BGA package. It is well suited to designers seeking to consolidate functions onto a single FPGA for networking, data acquisition, video processing, or embedded control systems while maintaining a commercial temperature profile and low-voltage core operation.

Because this device is part of the Lattice ECP3 family, it benefits from family-level capabilities such as advanced I/O standards, DSP slice architecture, and SERDES support described in the ECP3 family documentation—delivering a scalable platform for long-term product development and integration.

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