LFE3-35EA-8FN672I

The LFE3-35EA-8FN672I is a Lattice Semiconductor ECP3 family FPGA in a 672-ball BGA package, offering 33,000 logic elements and approximately 1.36 Mbits of on-chip RAM. Built for industrial applications, it combines mid-range logic density with a broad, programmable I/O set and integrated timing and SERDES features to support communications, DSP and system integration tasks.

Key Features

• Core & Logic 33,000 logic elements / cells provide a mid-range logic fabric suitable for complex glue logic, control and moderate DSP tasks.
• Embedded Memory Approximately 1.36 Mbits of total RAM bits for on-chip buffering, FIFOs and design-local storage.
• DSP & Multipliers ECP3 family sysDSP architecture and dedicated multipliers (as defined for the ECP3-35 device class in the family data sheet) support common multiply-accumulate and signal processing functions.
• Embedded SERDES Family-level SERDES support up to multi-gigabit speeds (family data sheet) with package-specific channel availability matching the 672-ball configuration.
• I/O Capacity & Standards 310 user I/Os with programmable sysI/O buffer support for a wide range of interface standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS and others as documented for the ECP3 family).
• Clocking & Timing On-chip PLLs and DLLs available in the ECP3 family provide flexible clock management for system timing.
• Package & Mounting 672-BBGA / 672-FPBGA (27 × 27 mm) surface-mount package for compact board integration and high I/O density.
• Power & Temperature Core supply range 1.14 V to 1.26 V and industrial-grade operating temperature from -40 °C to 100 °C for deployment in harsh environments.
• Regulatory RoHS compliant.

Typical Applications

• Communications & Networking SERDES-enabled links and a high I/O count make this device suitable for mid-range line cards, protocol bridging and interface aggregation.
• Industrial Control Industrial temperature rating and programmable I/O support sensor interfacing, motor control logic and deterministic system glue.
• Video & Imaging On-chip RAM and DSP-oriented resources support buffering and moderate image-processing pipelines.
• Embedded System Integration Use as a flexible logic hub for microcontroller offload, custom peripherals and board-level glue where compact package and rich I/O are needed.

Unique Advantages

• Balanced Logic Density: 33,000 logic elements provide a balance between capacity and cost for mid-range FPGA designs.
• Substantial On-Chip RAM: Approximately 1.36 Mbits of embedded memory enables efficient local buffering and low-latency data paths.
• High I/O Count: 310 user I/Os in a 672-ball package reduce the need for external interface chips and simplify board routing for multi-interface designs.
• Industrial Temperature Range: Rated for -40 °C to 100 °C, supporting deployment in industrial and outdoor applications.
• Compact, High-Density Package: 672-FPBGA (27 × 27 mm) delivers high I/O and logic capacity in a compact footprint.
• Low Core Voltage: Narrow core supply window (1.14–1.26 V) allowing predictable power budgeting for system design.

Why Choose LFE3-35EA-8FN672I?

The LFE3-35EA-8FN672I positions itself as a practical mid-range FPGA choice for designers who need a combination of moderate logic capacity, substantial on-chip RAM and a high-count, programmable I/O set in an industrial-grade package. It is well suited to communications, embedded system integration and industrial control applications that demand reliable operation across a wide temperature range and compact board-level integration.

Backed by the ECP3 family feature set documented in the device data, this FPGA offers clocking, SERDES and DSP-oriented resources that make it a flexible building block for systems requiring integrated timing, serial interfaces and local memory without committing to higher-capacity device classes.

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