LFE3-35EA-8LFN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA

Quantity 745 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / CaseTrayNumber of I/O295Voltage1.14 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs4125Number of Logic Elements/Cells33000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1358848

Overview of LFE3-35EA-8LFN484I – ECP3 Field Programmable Gate Array (FPGA), 33,000 logic elements

The LFE3-35EA-8LFN484I is a Lattice ECP3 family FPGA in a 484‑FPBGA (23 × 23 mm) package, offering 33,000 logic elements and 295 user I/Os. It targets industrial applications that require a balance of logic density, embedded memory and configurable I/O in a surface-mount, tray-packaged device operating from −40 °C to 100 °C.

Built on the ECP3 architecture, this device combines on-chip memory, DSP resources and programmable I/O to support a wide range of embedded processing and interface tasks while operating from a 1.14 V supply.

Key Features

  • Logic Capacity  Provides 33,000 logic elements suitable for mid-range FPGA designs and system integration.
  • Embedded Memory  Total on-chip RAM is 1,358,848 bits (approximately 1.36 Mbits), enabling storage for buffering, packet handling and embedded data structures.
  • High I/O Count  295 user I/Os in the 484‑FPBGA package support complex interfacing and parallel bus connectivity.
  • Package & Mounting  484‑FPBGA (23 × 23 mm) supplier device package; surface-mount mounting in tray format for standard PCB assembly flows.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Core Supply  Operates from a 1.14 V core supply as specified for this device.
  • DSP & Multiplier Resources  Includes 64 18×18 multipliers for efficient multiply-accumulate and DSP-oriented workloads (per ECP3 family data).
  • Clocking & SerDes  ECP3 family supports multiple PLLs/DLLs (4 PLLs / 2 DLLs for this device class) and the 484‑FPBGA package supports up to 4 SERDES channels, enabling high-speed serial and multi-channel interface support (per family data).

Typical Applications

  • Telecommunications & Networking  Use as a protocol bridge, packet buffering or custom interface controller leveraging the device's high I/O count and embedded memory.
  • Industrial Control  Implement motor-control logic, sensor aggregation and deterministic I/O handling within the specified industrial temperature range.
  • Video and Imaging  On-chip memory and DSP multipliers support buffering and real-time processing tasks in mid-range video pipelines.
  • Data Acquisition & Signal Processing  Combine multiplier slices and embedded RAM for preprocessing, filtering and aggregation of sensor data streams.

Unique Advantages

  • Balanced Logic and Memory  33,000 logic elements with approximately 1.36 Mbits of on-chip RAM simplifies integration of control, buffering and processing functions on a single device.
  • High I/O Density  295 user I/Os in a 23 × 23 mm FPBGA package reduce board-level wiring complexity for feature-rich systems.
  • Industrial Robustness  Specified operation from −40 °C to 100 °C addresses demanding thermal environments common in industrial applications.
  • DSP Acceleration  A substantial complement of 18×18 multipliers accelerates fixed-point and signal-processing workloads without external accelerators.
  • Flexible High-Speed Interfaces  ECP3 family clocking resources and SERDES channel support (package-dependent) enable deployment of high-speed serial links alongside parallel I/O.
  • Standard Surface-Mount Package  484‑FPBGA in tray packaging aligns with common SMT assembly and supply-chain practices.

Why Choose LFE3-35EA-8LFN484I?

The LFE3-35EA-8LFN484I positions itself as a mid-range, industrial-temperature FPGA that brings together substantial logic capacity, embedded memory and extensive I/O in a compact 484‑FPBGA package. It is well suited for designers who need a single-device solution for control, signal processing and interface tasks with predictable thermal and supply requirements.

Because it is part of the Lattice ECP3 family, this device benefits from the family’s clocking, DSP and SERDES capabilities, delivering a scalable option for applications that may require higher interconnect or DSP density within the same product family.

Request a quote or submit a purchase inquiry for LFE3-35EA-8LFN484I to receive pricing and availability for your next design.

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