LFE3-35EA-8LFN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA |
|---|---|
| Quantity | 745 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 295 | Voltage | 1.14 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-8LFN484I – ECP3 Field Programmable Gate Array (FPGA), 33,000 logic elements
The LFE3-35EA-8LFN484I is a Lattice ECP3 family FPGA in a 484‑FPBGA (23 × 23 mm) package, offering 33,000 logic elements and 295 user I/Os. It targets industrial applications that require a balance of logic density, embedded memory and configurable I/O in a surface-mount, tray-packaged device operating from −40 °C to 100 °C.
Built on the ECP3 architecture, this device combines on-chip memory, DSP resources and programmable I/O to support a wide range of embedded processing and interface tasks while operating from a 1.14 V supply.
Key Features
- Logic Capacity Provides 33,000 logic elements suitable for mid-range FPGA designs and system integration.
- Embedded Memory Total on-chip RAM is 1,358,848 bits (approximately 1.36 Mbits), enabling storage for buffering, packet handling and embedded data structures.
- High I/O Count 295 user I/Os in the 484‑FPBGA package support complex interfacing and parallel bus connectivity.
- Package & Mounting 484‑FPBGA (23 × 23 mm) supplier device package; surface-mount mounting in tray format for standard PCB assembly flows.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
- Core Supply Operates from a 1.14 V core supply as specified for this device.
- DSP & Multiplier Resources Includes 64 18×18 multipliers for efficient multiply-accumulate and DSP-oriented workloads (per ECP3 family data).
- Clocking & SerDes ECP3 family supports multiple PLLs/DLLs (4 PLLs / 2 DLLs for this device class) and the 484‑FPBGA package supports up to 4 SERDES channels, enabling high-speed serial and multi-channel interface support (per family data).
Typical Applications
- Telecommunications & Networking Use as a protocol bridge, packet buffering or custom interface controller leveraging the device's high I/O count and embedded memory.
- Industrial Control Implement motor-control logic, sensor aggregation and deterministic I/O handling within the specified industrial temperature range.
- Video and Imaging On-chip memory and DSP multipliers support buffering and real-time processing tasks in mid-range video pipelines.
- Data Acquisition & Signal Processing Combine multiplier slices and embedded RAM for preprocessing, filtering and aggregation of sensor data streams.
Unique Advantages
- Balanced Logic and Memory 33,000 logic elements with approximately 1.36 Mbits of on-chip RAM simplifies integration of control, buffering and processing functions on a single device.
- High I/O Density 295 user I/Os in a 23 × 23 mm FPBGA package reduce board-level wiring complexity for feature-rich systems.
- Industrial Robustness Specified operation from −40 °C to 100 °C addresses demanding thermal environments common in industrial applications.
- DSP Acceleration A substantial complement of 18×18 multipliers accelerates fixed-point and signal-processing workloads without external accelerators.
- Flexible High-Speed Interfaces ECP3 family clocking resources and SERDES channel support (package-dependent) enable deployment of high-speed serial links alongside parallel I/O.
- Standard Surface-Mount Package 484‑FPBGA in tray packaging aligns with common SMT assembly and supply-chain practices.
Why Choose LFE3-35EA-8LFN484I?
The LFE3-35EA-8LFN484I positions itself as a mid-range, industrial-temperature FPGA that brings together substantial logic capacity, embedded memory and extensive I/O in a compact 484‑FPBGA package. It is well suited for designers who need a single-device solution for control, signal processing and interface tasks with predictable thermal and supply requirements.
Because it is part of the Lattice ECP3 family, this device benefits from the family’s clocking, DSP and SERDES capabilities, delivering a scalable option for applications that may require higher interconnect or DSP density within the same product family.
Request a quote or submit a purchase inquiry for LFE3-35EA-8LFN484I to receive pricing and availability for your next design.

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