LFE3-35EA-8LFTN256I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA |
|---|---|
| Quantity | 19 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 133 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-8LFTN256I – ECP3 Field Programmable Gate Array (FPGA), 33,000 logic elements
The LFE3-35EA-8LFTN256I is an ECP3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides reconfigurable logic resources and embedded memory in a compact 256-FTBGA (17×17) surface-mount package and is specified for industrial-grade use.
With 33,000 logic elements, approximately 1.36 Mbits of embedded memory and 133 programmable I/Os, this device targets industrial embedded applications that require flexible, field-programmable logic, moderate on-chip RAM and a small-footprint BGA package.
Key Features
- Logic Capacity — 33,000 logic elements suitable for mid-range programmable logic designs.
- Embedded Memory — approximately 1.36 Mbits of on-chip RAM to support buffering, FIFOs and small data stores.
- I/O Count — 133 I/O pins to handle multiple peripheral interfaces and system signals.
- Power — Core supply voltage specified at 1.14 V to 1.26 V, enabling predictable core power planning.
- Package & Mounting — 256-FTBGA (17×17) package, surface-mount for compact board designs.
- Temperature & Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Regulatory — RoHS compliant.
Typical Applications
- Industrial Automation — Implement motor control logic, sensor interfacing and deterministic control functions using the device’s logic elements and I/Os within an industrial temperature window.
- Test & Measurement — Create custom data acquisition and preprocessing logic where on-chip RAM and multiple I/Os enable buffering and signal routing.
- Embedded System Prototyping — Rapidly prototype and iterate mid-complexity programmable logic designs in a compact 256-BGA package suitable for industrial boards.
Unique Advantages
- High logic density: 33,000 logic elements provide substantial programmable resources for mid-range designs without external discrete logic.
- Integrated on-chip memory: Approximately 1.36 Mbits of embedded RAM reduces the need for external memory for buffering and small data stores.
- Ample I/O availability: 133 I/Os support multiple peripheral connections and flexible signal partitioning.
- Industrial-rated operation: Specified −40 °C to 100 °C operating range enables deployment in temperature-challenging industrial environments.
- Compact package: 256-FTBGA (17×17) surface-mount footprint supports space-constrained PCB layouts.
- RoHS compliant: Meets RoHS requirements for environmental compliance in assemblies.
Why Choose LFE3-35EA-8LFTN256I?
As a member of the ECP3 FPGA family from Lattice Semiconductor, the LFE3-35EA-8LFTN256I combines a mid-range logic element count with useful on-chip memory and a high I/O count in a compact industrial-grade package. These characteristics make it well suited for embedded industrial applications where reconfigurable logic, moderate memory and broad I/O capability are required in a small footprint.
This device is aimed at engineers designing industrial controls, test equipment and embedded prototypes who need predictable voltage and temperature specifications, RoHS compliance and a BGA package for space-optimized boards.
Request a quote or submit an inquiry to receive pricing and availability for the LFE3-35EA-8LFTN256I and to discuss how it can fit into your next industrial FPGA design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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