LFE3-35EA-9FN484C

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA

Quantity 127 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells33000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1358848

Overview of LFE3-35EA-9FN484C – ECP3 Field Programmable Gate Array (FPGA), 33,000 Logic Elements, 484-BBGA

The LFE3-35EA-9FN484C is an ECP3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It integrates 33,000 logic elements and approximately 1.36 Mbits of embedded memory alongside a high I/O count, delivering a compact, resource-rich programmable device.

Packaged in a 484-BBGA (supplier package: 484-FPBGA, 23×23) surface-mount package and rated for commercial operation, this device is suited to designs that require substantial on-chip logic, memory, and I/O in a single FPGA solution.

Key Features

  • Core / Logic 33,000 logic elements and 4,125 logic blocks provide significant on-chip programmable logic capacity for complex functions and custom logic implementation.
  • Embedded Memory Approximately 1.36 Mbits of on-chip RAM for buffering, packet storage, and fast local data access.
  • I/O Density 295 I/O pins support wide connectivity and multiple external interfaces directly from the FPGA fabric.
  • Power Core supply voltage range of 1.14 V to 1.26 V, enabling predictable power budgeting for the device core.
  • Package & Mounting 484-BBGA (484-FPBGA, 23×23) surface-mount package for high pin density in a compact footprint.
  • Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance RoHS compliant.

Unique Advantages

  • High logic capacity: 33,000 logic elements and 4,125 logic blocks enable implementation of complex digital functions on-chip, reducing external component needs.
  • Substantial on-chip memory: Approximately 1.36 Mbits of embedded RAM supports data buffering and local storage without immediate dependence on external memory.
  • Broad I/O count: 295 I/Os provide flexibility for interfacing multiple peripherals, sensors, or parallel data buses.
  • Compact, high-density package: 484-BBGA (23×23) surface-mount package facilitates dense PCB designs while preserving a high pin count.
  • Predictable power planning: Narrow core voltage window (1.14 V to 1.26 V) simplifies core power supply design and verification.
  • Commercial-grade operation and compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Why Choose LFE3-35EA-9FN484C?

The LFE3-35EA-9FN484C combines a substantial logic fabric (33,000 logic elements and 4,125 logic blocks), approximately 1.36 Mbits of embedded RAM, and 295 I/Os in a compact 484-BBGA surface-mount package. These attributes make it a practical choice for designs that need significant on-chip resources and high connectivity in a commercial-temperature FPGA.

Manufactured by Lattice Semiconductor Corporation and RoHS compliant, this device is suitable for engineers seeking a programmable solution with defined electrical and thermal characteristics for commercial applications.

Request a quote or submit an inquiry for pricing and availability for the LFE3-35EA-9FN484C. Our team can provide product availability and ordering information to support your design planning.

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