LFE3-35EA-9FTN256C

The LFE3-35EA-9FTN256C is a Lattice Semiconductor ECP3 family field programmable gate array (FPGA) offered in a 256-ball fine-pitch BGA. It provides a balanced mix of programmable logic, embedded memory and serial/I/O resources for mid-density, performance-oriented designs. Targeted use cases include high-speed serial communications, DSP-accelerated signal processing and general embedded logic where integration and configurable I/O are important.

Key Features

• Logic Capacity – 33,000 logic elements suitable for mid-density programmable designs.
• Embedded Memory – Approximately 1.33 Mbits of on-chip RAM (total RAM bits: 1,358,848) to support buffers, FIFOs and local data storage.
• DSP Resources – Family-level sysDSP architecture and support for 18×18 multipliers (ECP3-35 provides 64 multipliers) enable multiply-accumulate and high-performance integer math operations.
• High-Speed SERDES and Interfaces – ECP3 family includes embedded SERDES and a broad range of source-synchronous I/O support for high-speed serial links and parallel interfaces (family features listed in datasheet).
• I/O Count and Package – 133 user I/Os in a surface-mount 256-FTBGA (17 × 17 mm) package, enabling dense peripheral connectivity in a compact footprint.
• Clocking and Timing – On-chip PLLs/DLLs available at the family level (ECP3-35 lists 4 PLLs / 2 DLLs) for flexible clock management and low-jitter timing.
• Power – Core supply voltage range 1.14 V to 1.26 V to match system power rails and support efficient core operation.
• Operating Conditions – Commercial temperature grade with operating range 0 °C to 85 °C and RoHS compliance for regulatory alignment.
• Mounting – Surface-mount package suitable for automated PCB assembly and compact system designs.

Typical Applications

• High‑Speed Communications: SERDES and source-synchronous I/O in the ECP3 family support implementation of serial links and protocol bridging for network and transport applications.
• DSP and Signal Processing: sysDSP architecture and multiple 18×18 multipliers enable filtering, accumulation and other compute-heavy signal tasks.
• Memory Interface and Buffering: On-chip embedded RAM (approximately 1.33 Mbits) supports packet buffering, FIFO staging and local frame storage for data-streaming systems.
• Embedded Control and Glue Logic: 33,000 logic elements with 133 I/Os provide flexible implementation of control logic, peripheral interfaces and protocol conversion.

Unique Advantages

• Mid‑density integration: 33,000 logic elements and substantial embedded memory consolidate system functions and reduce external components.
• Compact package with ample I/O: 256-FTBGA (17 × 17 mm) package delivers 133 user I/Os for flexible board-level routing without a large footprint.
• DSP-capable fabric: Family DSP slices and multiple 18×18 multipliers accelerate arithmetic-heavy workloads common in communications and signal processing.
• Flexible clocking: On-chip PLLs/DLLs at the family level enable adaptable clock domains and deterministic timing for mixed-rate systems.
• Low-voltage core: 1.14–1.26 V core supply supports efficient power budget planning in modern systems.
• Regulatory and assembly readiness: RoHS compliance and surface-mount packaging streamline manufacturing and environmental requirements.

Why Choose LFE3-35EA-9FTN256C?

The LFE3-35EA-9FTN256C combines a mid-range logic count, meaningful on-chip memory and a compact 256-FTBGA package to deliver a tightly integrated FPGA option for designs that need balanced performance and density. Its place in the Lattice ECP3 family gives access to DSP-oriented slices, SERDES-capable I/O and flexible clocking resources, making it well suited to communications, video/streaming and embedded control applications.

This device is tailored for engineering teams seeking a commercially graded FPGA that provides scalability within the ECP3 family, predictable operating conditions (0 °C to 85 °C) and compliance with RoHS requirements.

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