LFE3-35EA-9FTN256I

The LFE3-35EA-9FTN256I is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-range logic fabric with 33,000 logic elements and approximately 1.36 Mbits of embedded memory, packaged in a 256‑BGA surface-mount device.

Designed for industrial applications, this device combines significant on-chip memory and a 133‑pin I/O count with an industrial operating range and a narrow core voltage window for consistent system integration.

Key Features

• Core Capacity 33,000 logic elements suitable for mid-density FPGA implementations and custom logic functions.
• Embedded Memory Approximately 1.36 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Resources 133 user I/O pins to support multiple peripheral and interface connections on a single device.
• Power Supply Operates from 1.14 V to 1.26 V, matching common core voltage rails for deterministic power design.
• Package & Mounting 256‑BGA package (supplier device package: 256‑FTBGA 17×17) in a surface-mount format for compact PCB integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, meeting typical industrial environment requirements.
• Manufacturer Produced by Lattice Semiconductor Corporation and offered in an industrial-grade configuration.
• Regulatory Compliance RoHS compliant for environmentally responsible design and manufacturing.

Typical Applications

• Industrial Control Use the industrial temperature rating and abundant I/O to implement motor control, sensor interfacing, and machine automation logic.
• Embedded Systems Leverage the 33,000 logic elements and on-chip RAM for custom protocol implementation, data handling, and application-specific accelerators.
• Communications & Interfaces 133 I/Os enable protocol bridging, signal conditioning, and multi-channel interfacing in communication and instrumentation designs.

Unique Advantages

• Balanced Logic and Memory 33,000 logic elements combined with approximately 1.36 Mbits of embedded memory provide a practical balance for mid-range FPGA tasks without external RAM.
• High I/O Count 133 user I/Os help consolidate peripheral connections and reduce the need for additional interface components.
• Industrial Reliability Industrial grade designation and a −40 °C to 100 °C operating range support deployment in demanding environments.
• Compact Integration 256‑BGA (256‑FTBGA 17×17) surface-mount packaging enables dense PCB layouts and compact system designs.
• Predictable Power Envelope A defined 1.14 V to 1.26 V supply window simplifies power sequencing and core voltage planning.

Why Choose LFE3-35EA-9FTN256I?

The LFE3-35EA-9FTN256I positions itself as a mid-density, industrial-grade FPGA option that blends substantial logic capacity with on-chip memory and a generous I/O complement. Its package and supply characteristics make it suitable for compact, robust designs that require deterministic power rails and industrial temperature operation.

This device is well suited to engineers building embedded systems, industrial controllers, and interface-intensive equipment who need reprogrammable logic density, reliable temperature performance, and a compact surface-mount package from a recognized FPGA manufacturer.

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