LFE3-70E-6FN1156C

The LFE3-70E-6FN1156C is an ECP3-series field programmable gate array (FPGA) IC offering 67,000 logic elements and approximately 4.5 Mbits of embedded RAM. Designed for applications that require a high logic element count combined with a large I/O complement, this device provides a programmable fabric in a 1156-BBGA package for compact system integration.

Key attributes include a 490-pin I/O capability, low-voltage core operation, and a commercial operating temperature range, making it suitable for a wide range of programmable-logic designs that must balance density and board-area efficiency.

Key Features

• Core Logic  67,000 logic elements deliver substantial programmable capacity for implementing complex digital functions.
• Embedded Memory  Approximately 4.5 Mbits of on-chip RAM to support buffers, FIFOs, and lookup tables within the FPGA fabric.
• I/O Capability  490 user I/Os provide extensive external connectivity for interfacing with peripherals, buses, and external devices.
• Package and Mounting  1156-BBGA (1156-FPBGA, 35 × 35 mm) package in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements for the FPGA core.
• Temperature and Grade  Commercial operating temperature range of 0 °C to 85 °C and commercial device grade.
• Environmental Compliance  RoHS-compliant construction supports lead-free manufacturing requirements.

Typical Applications

• High-density digital logic integration  Implement complex programmable logic and glue logic where a large count of logic elements and on-chip RAM are required.
• Multi-interface bridging  Use the 490 I/Os to connect and translate between multiple parallel and serial interfaces on a single FPGA.
• Embedded system prototyping  Evaluate and prototype system functions that need significant programmable resources and a compact package footprint.

Unique Advantages

• Substantial logic capacity: 67,000 logic elements provide room to implement large logic designs without immediate migration to a larger device.
• Generous embedded memory: Approximately 4.5 Mbits of on-chip RAM reduces the need for external memory in many buffering and data-path applications.
• Extensive I/O count: 490 I/Os enable broad external connectivity and simplify board-level wiring for multi-domain systems.
• Compact, industry-standard package: 1156-BBGA (35 × 35 mm) package supports dense PCB layouts while maintaining surface-mount assembly compatibility.
• Low-voltage core: Core supply range of 1.14 V to 1.26 V provides clear power-supply requirements for system power budgeting.
• RoHS compliant: Meets lead-free assembly and environmental compliance requirements.

Why Choose LFE3-70E-6FN1156C?

The LFE3-70E-6FN1156C combines a substantial logic element count, significant on-chip RAM, and a high I/O count in a compact 1156-BBGA package. It is positioned for designers who need programmable density and broad connectivity within a commercial-temperature FPGA solution. The device’s defined voltage range and RoHS compliance simplify power and manufacturing planning, while the package supports space-efficient board layouts.

This FPGA suits engineering teams and procurement managers seeking a programmable logic device that balances capacity, I/O capability, and manufacturability for a variety of embedded and system-integration projects.

Request a quote or submit an inquiry to receive pricing and availability for the LFE3-70E-6FN1156C.