LFE3-70E-6FN1156I

The LFE3-70E-6FN1156I is an ECP3 family field programmable gate array (FPGA) offered in a 1156-ball BBGA package. It provides a balance of programmable logic capacity, on-chip memory, and a high I/O count for designs that require flexible digital integration. With industrial-grade qualification and a wide operating temperature range, this device is intended for applications that demand dependable operation across challenging environments.

Key Features

• Core Logic  Approximately 67,000 logic elements for implementing custom digital functions and complex combinational/sequential logic.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped logic structures.
• I/O Density  490 user I/Os to enable extensive external device interfacing and parallel connectivity.
• Power  Operates from a core supply range of 1.14 V to 1.26 V, providing a defined low-voltage core domain for system power planning.
• Package & Mounting  1156-BBGA (supplier device package: 1156-FPBGA, 35×35 mm) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C, supporting deployment in industrial environments.
• Environmental Compliance  RoHS compliant to meet common regulatory and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the device to implement custom control logic and interface functions where industrial-grade temperature range and reliability are required.
• High-Density I/O Processing  Leverage 490 I/Os for designs that require extensive external device connections, sensor arrays, or parallel data paths.
• Embedded Memory-Dependent Logic  On-chip RAM (approximately 4.53 Mbits) supports buffering, FIFOs, and small data stores for real-time processing tasks.

Unique Advantages

• High Logic Capacity: 67,000 logic elements provide substantial programmable resources for mid-to-large scale digital designs.
• Significant On-Chip Memory: Approximately 4.53 Mbits of embedded RAM reduce external memory requirements and simplify board-level design.
• Extensive I/O Count: 490 I/Os enable broad external interfacing and flexible signal routing for complex systems.
• Industrial Robustness: Industrial grade classification and –40 °C to 100 °C operating range support deployment in demanding thermal environments.
• Compact Package: 1156-ball BBGA (1156-FPBGA, 35×35) surface-mount package offers a high-density solution for space-constrained PCBs.
• Regulatory Compliance: RoHS compliance aligns with common manufacturing and product stewardship requirements.

Why Choose LFE3-70E-6FN1156I?

The LFE3-70E-6FN1156I positions itself as a high-capacity, industrial-grade FPGA option where programmable logic density, embedded memory, and extensive I/O are required in a compact surface-mount package. Its specified core voltage range and broad operating temperature make it suitable for engineers designing robust embedded systems that must operate reliably across varied environments.

This device is well suited for development teams and procurement organizations focused on scalable FPGA-based implementations that prioritize on-chip resources and I/O flexibility while meeting environmental compliance and industrial temperature requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE3-70E-6FN1156I or to discuss your application requirements with our team.