LFE3-70E-6FN672I

The LFE3-70E-6FN672I is an ECP3 field programmable gate array (FPGA) provided in a 672-ball BGA package. It delivers approximately 67,000 logic elements and roughly 4.53 Mbits of on-chip RAM, combined with 380 I/O pins for board-level integration.

This device is supplied in a surface-mount 672-FPBGA (27x27) package, operates from 1.14 V to 1.26 V, and is specified for industrial-grade operation across a –40 °C to 100 °C temperature range. It is RoHS compliant.

Key Features

• Logic Capacity  Approximately 67,000 logic elements to implement complex programmable logic functions.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) for data buffering, state storage, and scratchpad use.
• I/O Resources  380 I/O pins to support a wide range of external interfaces and peripheral connections.
• Package & Mounting  672-BBGA package in a surface-mount form factor; supplier device package listed as 672-FPBGA (27x27).
• Power  Core supply voltage range from 1.14 V to 1.26 V for system-level power planning.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C and specified as Industrial grade for use in temperature-demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use in control and automation systems where the combination of industrial temperature rating, extensive I/O, and programmable logic is required.
• Logic-Intensive Designs  Suited for applications that need approximately 67,000 logic elements and several megabits of embedded memory for custom logic and state machines.
• I/O-Heavy Interfaces  Integration of multiple external peripherals and sensors leveraging 380 I/O connections.
• Compact Board-Level Integration  Surface-mount 672-BBGA / 672-FPBGA package for space-constrained PCBs.

Unique Advantages

• Substantial Logic Resources: Approximately 67,000 logic elements enable implementation of complex programmable functions without additional external logic.
• Integrated On-Chip Memory: Approximately 4.53 Mbits of embedded RAM reduces the need for external memory for many buffering and state requirements.
• High I/O Count: 380 I/O pins provide flexibility for connecting multiple peripherals, sensors, and interface channels.
• Industrial Temperature Rating: Specified for –40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact Surface-Mount Package: 672-BBGA / 672-FPBGA (27x27) package supports compact PCB layouts and surface-mount assembly.
• Low-Voltage Core: Core supply range of 1.14 V to 1.26 V supports systems designed around similar core voltages.

Why Choose LFE3-70E-6FN672I?

The LFE3-70E-6FN672I combines a high count of logic elements, several megabits of embedded RAM, and a large number of I/Os in a compact surface-mount 672-BBGA package. Its industrial temperature rating and RoHS compliance make it appropriate for designs that require robust operation across a wide temperature range.

This device is well suited for engineers and procurement teams specifying FPGAs for applications that need substantial programmable logic, embedded memory, and extensive I/O in a compact board-level package.

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