LFE3-70E-7FN484I

The LFE3-70E-7FN484I is an ECP3 Field Programmable Gate Array (FPGA) IC designed for industrial applications. It combines a high logic capacity with substantial embedded memory and a large I/O count in a compact BGA package.

This device is intended for designs that require programmable logic, on-chip memory resources and extensive I/O while operating across a wide industrial temperature range.

Key Features

• Core Logic  Provides 67,000 logic elements to implement complex custom logic, state machines and glue logic directly on-chip.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM to support buffering, lookup tables and intermediate storage without immediate reliance on external memory.
• I/O Capacity  295 I/O pins to accommodate multiple interfaces and parallel signals within a single device.
• Power Supply  Core voltage specified at 1.14 V to 1.26 V to match system power domains and enable predictable power budgeting.
• Package & Mounting  484-BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Deploy where industrial-grade temperature tolerance and a high I/O count are required for custom control logic and interfacing.
• Embedded Systems  Implement complex state machines, protocol handling and glue logic using the device’s 67,000 logic elements and on-chip RAM.
• High-Density I/O Designs  Use the 295 available I/Os and compact 484-BBGA package to support multi-interface systems without extensive external I/O expansion.

Unique Advantages

• High Logic Capacity: 67,000 logic elements enable integration of substantial custom logic into a single device.
• Substantial On-Chip Memory: Approximately 4.53 Mbits of embedded RAM reduces dependency on external memory for many buffering and lookup tasks.
• Large I/O Count: 295 I/Os support multiple interfaces and parallel signal requirements, simplifying board-level design.
• Industrial-Grade Operation: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact Surface-Mount BGA: 484-BBGA (23×23 FPBGA) package enables space-efficient PCB layouts while keeping signals localized.
• Defined Core Voltage Range: 1.14 V to 1.26 V core supply allows clear power-domain planning in multi-voltage systems.

Why Choose LFE3-70E-7FN484I?

The LFE3-70E-7FN484I targets designs that require a balance of high logic density, meaningful embedded memory and broad I/O capability within an industrial temperature-rated FPGA. Its combination of 67,000 logic elements, approximately 4.53 Mbits of on-chip RAM and 295 I/Os in a compact 484-BBGA package makes it suitable for embedded and industrial applications where integration and predictable environmental performance matter.

For teams building constrained-board, performance-sensitive or temperature-demanding systems, this FPGA provides a scalable, integrated option that consolidates logic and memory resources while simplifying board-level I/O requirements.

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