LFE3-70E-7FN672I

The LFE3-70E-7FN672I is an ECP3 series Field Programmable Gate Array from Lattice Semiconductor Corporation. It delivers high-density programmable logic with a substantial number of I/Os and on-chip memory for complex embedded designs.

Engineered for industrial applications, this surface-mount FPGA provides 67,000 logic elements, approximately 4.53 Mbits of embedded memory, and up to 380 I/O pins, while supporting operation from -40°C to 100°C and a core supply range of 1.14 V to 1.26 V.

Key Features

• Programmable Logic Capacity — 67,000 logic elements for implementing complex logic, control, and datapath functions.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM for buffering, LUT-based memory, and state storage.
• I/O Density — 380 general-purpose I/O pins to support broad connectivity and parallel interfaces.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system-level power planning.
• Package and Mounting — Available in a 672-BBGA package (supplier device package: 672-FPBGA, 27×27) optimized for surface-mount assembly.
• Industrial Temperature Range — Rated for operation from -40°C to 100°C to meet industrial environmental requirements.
• Regulatory Compliance — RoHS compliant, supporting lead-free assembly processes.

Typical Applications

• Industrial Control Systems — Use the FPGA’s high logic density and wide operating temperature range for control logic, signal aggregation, and real-time processing in industrial environments.
• Communication Equipment — Leverage 380 I/Os and abundant embedded RAM for protocol handling, interface bridging, and packet buffering.
• Embedded Processing — Implement custom accelerators and glue logic where sizable programmable logic and on-chip memory are required.

Unique Advantages

• High Logic Density: 67,000 logic elements enable complex designs without immediate need for external logic expansion, reducing BOM complexity.
• Substantial On-Chip Memory: Approximately 4.53 Mbits of embedded RAM supports buffering and local data storage to simplify system architecture.
• Extensive I/O Count: 380 I/Os provide flexibility for parallel interfaces and multiple peripheral connections.
• Industrial-Grade Operation: Rated from -40°C to 100°C for deployment in temperature-demanding environments.
• Surface-Mount, High-Density Package: 672-BBGA (672-FPBGA, 27×27) offers a compact footprint for board-level integration.
• RoHS Compliant: Supports lead-free manufacturing flows.

Why Choose LFE3-70E-7FN672I?

The LFE3-70E-7FN672I is positioned for designs that require a combination of significant logic capacity, plentiful on-chip memory, and high I/O counts within an industrial temperature envelope. Its surface-mount 672-BBGA package and defined core voltage range make it straightforward to integrate into compact, temperature-challenging systems.

This FPGA is suitable for engineers and procurement teams building industrial control, communication, and embedded processing products who need a high-density, RoHS-compliant programmable logic device with reliable temperature performance.

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