LFE3-70E-7FN484C

The LFE3-70E-7FN484C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, offering a high-density programmable logic fabric. With 67,000 logic elements, approximately 4.5 Mbits of embedded memory and 295 general-purpose I/Os, this device targets designs that require substantial on-chip logic, memory and I/O integration.

Designed for surface-mount assembly in a 484-BBGA package, the device operates from a core supply range of 1.14 V to 1.26 V and is specified for commercial temperature operation (0 °C to 85 °C). It is RoHS compliant.

Key Features

• Core Architecture  ECP3 Field Programmable Gate Array (FPGA) architecture with 67,000 logic elements for implementing complex digital logic.
• Embedded Memory  Approximately 4.5 Mbits of on-chip RAM (4,526,080 total RAM bits) to support buffering, lookup tables and data storage without external memory.
• I/O Capacity  295 user I/O pins to support wide parallel interfaces, multiple peripherals or numerous signal connections on a single device.
• Power  Core voltage supply range from 1.14 V to 1.26 V for defined power-domain integration in board designs.
• Package & Mounting  484-BBGA package (supplier device package: 484-FPBGA, 23×23) optimized for surface-mount assembly and compact board layouts.
• Operating Range  Commercial grade operation from 0 °C to 85 °C to match standard consumer and commercial electronics environments.
• Environmental  RoHS compliant for regulatory alignment with lead-free and restricted substance requirements.

Typical Applications

• High-density digital logic  Implement complex custom logic functions and control engines using the device’s 67,000 logic elements and on-chip RAM.
• I/O-intensive systems  Support multiple parallel interfaces, sensor arrays or peripheral buses with 295 available I/O pins.
• Embedded memory-dependent designs  Use approximately 4.5 Mbits of embedded RAM for data buffering, lookup tables and state storage without immediate external memory.
• Board-level prototypes and development  Evaluate and iterate digital designs on a compact 484-BBGA package suitable for surface-mount PCB implementations.

Unique Advantages

• High logic capacity: 67,000 logic elements provide the density needed for complex programmable logic implementations.
• Substantial on-chip memory: Approximately 4.5 Mbits of embedded RAM reduces dependency on external memory for many control and buffering tasks.
• Extensive I/O: 295 I/O pins enable broad interfacing options for parallel buses, peripherals and multiple signal domains.
• Compact BGA packaging: 484-BBGA (484-FPBGA, 23×23) keeps board footprint efficient while supporting surface-mount assembly processes.
• Controlled core voltage: Narrow 1.14 V to 1.26 V supply range simplifies power-domain planning and predictable power integration.
• Regulatory alignment: RoHS compliance supports lead-free manufacturing and regulatory requirements.

Why Choose LFE3-70E-7FN484C?

The LFE3-70E-7FN484C positions itself as a high-density, commercial-grade FPGA for designs that require a blend of programmable logic capacity, embedded memory and extensive I/O in a compact surface-mount package. Its specified core voltage range and commercial operating temperature make it suitable for consumer and commercial electronics projects that demand predictable electrical and thermal behavior.

This device is well-suited for engineering teams tackling complex digital functions, I/O-rich interfaces and designs that benefit from substantial on-chip RAM. With RoHS compliance and a standardized 484-BBGA footprint, it offers a pragmatic choice for product development, prototyping and production where a high logic count and significant embedded memory are priorities.

Request a quote or submit a purchase inquiry to receive pricing and lead-time information for the LFE3-70E-7FN484C. Detailed technical documentation is available to support evaluation and integration.