LFE3-70E-7FN672C

The LFE3-70E-7FN672C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation’s ECP3 family. It delivers a high-density programmable logic fabric with clearly defined resources for embedded designs.

With 67,000 logic elements, approximately 4.53 Mbits of on-chip RAM and 380 I/O pins, this device is suited to designs that require substantial logic capacity, significant embedded memory and a large number of I/O connections while operating at a low core voltage.

Key Features

• Core Logic  67,000 logic elements provide substantial programmable fabric for complex digital designs.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM for buffering, lookup tables and temporary storage.
• I/O Density  380 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power Supply  Low-voltage core operation with a supply range of 1.14 V to 1.26 V to meet modern FPGA power domains.
• Package & Mounting  Supplied in a 672-BBGA package (672-FPBGA, 27 × 27 mm) for compact, surface-mount PCB integration.
• Operating Range & Grade  Commercial temperature grade specified from 0 °C to 85 °C for standard embedded and industrial-adjacent applications.
• Regulatory Compliance  RoHS-compliant construction to support lead-free manufacturing processes.

Typical Applications

• Custom digital logic implementations  Use the device to implement proprietary state machines, protocol bridges and data-path acceleration where significant logic capacity is required.
• Memory-intensive functions  Leverage approximately 4.53 Mbits of embedded RAM for buffering, packet processing or LUT-based algorithms.
• High-density I/O systems  Deploy in designs that need many parallel interfaces, external sensors or peripheral connectivity supported by 380 I/O pins.
• Compact board-level integration  The 672-FPBGA (27×27) package provides a high-pin-count solution for space-constrained PCBs using surface-mount assembly.

Unique Advantages

• High logic capacity: 67,000 logic elements enable complex digital designs without immediate need to partition across multiple devices.
• Substantial on-chip RAM: Approximately 4.53 Mbits of embedded memory reduces reliance on external memory for many buffering and processing tasks.
• Extensive I/O count: 380 user I/O pins support broad connectivity and facilitate parallel data paths.
• Low-voltage operation: 1.14 V–1.26 V supply range aligns with modern low-power core domains.
• Compact BGA footprint: 672-FPBGA (27 × 27 mm) provides a dense, surface-mount package for high-pin-count applications in limited PCB area.
• RoHS compliant: Supports lead-free manufacturing and regulatory requirements for many production environments.

Why Choose LFE3-70E-7FN672C?

The LFE3-70E-7FN672C positions a high-density ECP3 FPGA into a compact 672-BBGA package, combining 67,000 logic elements, approximately 4.53 Mbits of embedded RAM and 380 I/O pins. Its low-voltage core and commercial temperature grade make it a practical choice for embedded designs that demand significant programmable logic, on-chip memory and high I/O integration.

This device is suitable for engineering teams designing complex digital systems who need a high-capacity, RoHS-compliant FPGA from Lattice Semiconductor Corporation with clear, quantified resources for planning routing, power and board layout.

Request a quote or submit an RFQ to receive pricing and availability information for the LFE3-70E-7FN672C.