LFE3-70E-8FN484C

The LFE3-70E-8FN484C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a high logic capacity architecture with 67,000 logic elements and on-chip RAM, packaged in a compact 484-BBGA surface-mount device.

Designed for commercial-grade applications, this device offers a broad core voltage range and a large I/O count that support dense, integrated designs where board space and component consolidation matter.

Key Features

• Logic Capacity Approximately 67,000 logic elements to implement complex digital functions on a single device.
• Embedded Memory Approximately 4.53 Mbits of on-chip RAM (4,526,080 total RAM bits) to support buffering, state storage, and local data processing.
• I/O and Package Up to 295 I/O pins provided through a 484-ball BGA package; supplier device package listed as 484-FPBGA (23×23), enabling high pin-count routing in a compact footprint.
• Power Core supply range from 1.14 V to 1.26 V to match common low-voltage FPGA power architectures.
• Mounting and Form Factor Surface-mount 484-BBGA package supports compact PCB layouts and automated assembly.
• Operating Conditions Commercial-grade operation with an operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant for lead-free assembly and regulatory alignment.

Unique Advantages

• High integration density: 67,000 logic elements reduce the need for multiple discrete devices, simplifying BOM and board complexity.
• Substantial on-chip memory: Approximately 4.53 Mbits of embedded RAM supports local data buffering and state machines without external memory.
• Extensive I/O count: 295 I/Os in a 484-BBGA package enable rich peripheral and signal connectivity while maintaining a compact package footprint.
• Low-voltage core: Narrow core voltage range (1.14 V to 1.26 V) aligns with efficient power supply designs for modern embedded systems.
• Surface-mount BGA packaging: 484-ball BGA form factor helps optimize PCB real estate and supports automated manufacturing processes.
• Commercial-grade reliability: Rated for operation from 0 °C to 85 °C to meet typical commercial application environments.

Why Choose LFE3-70E-8FN484C?

The LFE3-70E-8FN484C delivers a balanced combination of high logic capacity, on-chip memory, and a large I/O complement in a compact 484-BBGA surface-mount package. Its specifications make it suitable for commercial electronic designs that require significant programmable logic and local memory in a space-efficient form factor.

For engineers and procurement teams focused on consolidating functionality and reducing board-level complexity, this ECP3 FPGA provides a clear path to integrating multiple functions into a single, RoHS-compliant device while operating within common commercial temperature and voltage ranges.

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