LFE3-70E-8FN672C

The LFE3-70E-8FN672C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, presented in a 672-ball BGA package. It provides a high-count logic resource with significant on-chip memory and a large I/O complement for commercial embedded designs.

With 67,000 logic elements, approximately 4.5 Mbits of embedded RAM and up to 380 I/Os, this device targets commercial applications that require dense logic integration, flexible I/O connectivity and a compact surface-mount package.

Key Features

• Core Logic 67,000 logic elements provide substantial programmable fabric for implementing complex digital functions.
• Embedded Memory Approximately 4.5 Mbits of on-chip RAM (4,526,080 bits) for data buffering, FIFOs and state storage without external memory.
• I/O Capacity Up to 380 user I/Os to support wide peripheral interfacing and multi-channel signal routing.
• Power Core voltage supply range of 1.14 V to 1.26 V for operation within specified power rails.
• Package and Mounting 672-ball fine-pitch BGA in a 672-FPBGA (27×27) footprint; surface-mount type suitable for compact PCB designs.
• Operating Range Commercial-grade operating temperature from 0 °C to 85 °C, suitable for standard commercial environments.
• Regulatory RoHS compliant to meet lead-free and hazardous-substance requirements.

Typical Applications

• Commercial Embedded Systems Use where a high number of logic elements and on-chip RAM support custom processing, protocol handling and control functions within commercial temperature ranges.
• High-Density I/O Interfaces Suitable for designs needing extensive I/O connectivity—up to 380 signals—for interfacing sensors, peripherals and board-level buses.
• Compact Board-Level Integration The 672-BBGA surface-mount package allows dense integration on PCBs where board space and component consolidation are priorities.

Unique Advantages

• Substantial Logic Capacity: 67,000 logic elements enable implementation of complex state machines, datapaths and custom accelerators on a single device.
• Integrated Memory: Approximately 4.5 Mbits of embedded RAM reduces the need for external memory components and simplifies board design.
• Extensive I/O Count: Up to 380 user I/Os provide flexibility for multi-interface designs and high channel counts without multiplexing compromises.
• Compact BGA Packaging: The 672-FPBGA (27×27) package supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation across typical commercial deployment environments.
• RoHS Compliance: Meets RoHS requirements for environmentally conscious product designs and global supply chains.

Why Choose LFE3-70E-8FN672C?

The LFE3-70E-8FN672C combines a large logic fabric, multiple megabits of embedded RAM and a high I/O count in a compact 672-ball BGA package, making it well suited for commercial-grade embedded and board-level applications that demand dense integration. Its defined core voltage range and commercial temperature rating provide clear electrical and environmental boundaries for system design.

Designed and manufactured by Lattice Semiconductor Corporation, this FPGA is a practical option for engineering teams seeking a single-device solution that consolidates logic, memory and connectivity while maintaining RoHS compliance.

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