LFE3-70EA-6FN484C

The LFE3-70EA-6FN484C is a Lattice Semiconductor ECP3 family FPGA delivering mid-to-high logic density and integrated high‑speed I/O capabilities in a compact 484‑BBGA package. Architected for designs that require substantial programmable logic, on‑chip memory and source‑synchronous/high‑speed serial interfaces, this device targets communications, signal processing and data‑interface applications where integration and configurable I/O matter.

This surface‑mount, commercial‑grade device provides 67,000 logic elements, approximately 4.53 Mbits of embedded memory and 295 user I/Os in a 484‑FPBGA (23 × 23 mm) package. Core supply operation is 1.14 V to 1.26 V and operating temperature is 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic – 67,000 logic elements for implementing complex finite state machines, datapaths and custom logic blocks.
• Embedded Memory – Approximately 4.53 Mbits of on‑chip RAM to support buffering, FIFOs and on‑chip data storage without external memory in many use cases.
• I/O Count & Package – 295 user I/Os in a 484‑BBGA / 484‑FPBGA (23 × 23 mm) package, enabling high pin‑count interfaces while maintaining a compact footprint.
• High‑Speed Serial & Source‑Synchronous I/O – ECP3 family features include embedded SERDES and pre‑engineered source‑synchronous I/O for interfaces and protocol support typically used in networking and high‑speed data applications.
• DSP & Arithmetic Resources – Family sysDSP capabilities and dedicated multiplier blocks (as provided by the ECP3 architecture) support multiply‑accumulate and other DSP functions for signal processing workloads.
• Clocking Resources – Device family provides multiple PLLs and DLLs to support flexible clocking and clock domain management suitable for complex systems.
• Configuration & System Support – Flexible configuration options are available within the ECP3 family, including SPI boot interfaces and dual‑boot capabilities (as documented for the family).
• Power & Mounting – Surface‑mount package with a 1.14 V to 1.26 V core supply range; commercial operating temperature range of 0 °C to 85 °C.
• Compliance – RoHS compliant.

Typical Applications

• Communications & Networking – High‑speed serial links and source‑synchronous interfaces supported by embedded SERDES make the device suitable for networking line cards, switches and protocol bridging.
• High‑Speed Data Acquisition & Signal Processing – Substantial logic density and on‑chip memory support real‑time DSP and multi‑channel data capture/processing for instrumentation and measurement systems.
• Video & Broadcast Interfaces – Source‑synchronous I/O and high‑speed serial capabilities address broadcast and video transport interface requirements where timing and throughput are critical.
• Memory Interface and Controller Prototyping – Rich I/O and embedded RAM enable implementation and validation of DDR/parallel memory interface logic and controller prototypes.

Unique Advantages

• High Logic Capacity: 67,000 logic elements enable integration of complex control, datapath and interfacing logic into a single device, reducing board count.
• Substantial On‑Chip Memory: Approximately 4.53 Mbits of embedded RAM supports buffering and local storage, minimizing dependence on external memory for many use cases.
• High Pin‑Count in a Compact Package: 295 I/Os in a 23 × 23 mm 484‑FPBGA package balance board‑level density with a compact mechanical footprint.
• Commercial‑Grade Power & Temperature Specs: Core voltage window of 1.14 V–1.26 V and 0 °C–85 °C operating range align with high‑volume commercial deployments.
• ECP3 Family Architecture: Built on the ECP3 family platform, benefiting from documented family features such as sysDSP, multiple PLLs/DLLs and pre‑engineered I/O support for a broad set of interfaces.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious product designs.

Why Choose LFE3-70EA-6FN484C?

The LFE3-70EA-6FN484C positions itself as a flexible, mid‑to‑high density FPGA option within the Lattice ECP3 family—combining significant logic capacity, on‑chip memory and a high I/O count in a compact 484‑FPBGA package. Its ECP3 architecture provides DSP‑oriented resources, clocking flexibility and high‑speed I/O capabilities useful for communications, data acquisition and interface designs.

This device is well suited to engineering teams and OEMs seeking a commercially graded, RoHS‑compliant FPGA platform with the integration needed to reduce external components while leveraging the ECP3 family toolchain and documented features for system‑level design and configuration.

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