LFE3-70EA-6FN672I

The LFE3-70EA-6FN672I is an industrial-grade Lattice ECP3 FPGA in a 672-BBGA (27×27 mm) surface-mount package. It delivers 67,000 logic elements, approximately 4.53 Mbits of embedded memory, and 380 user I/Os for mid-to-high-density programmable logic applications.

Built on the ECP3 family architecture, this device is designed for designs that require DSP functionality, high-speed serial interfaces and flexible memory and clocking resources, while operating from a 1.14 V to 1.26 V core supply over an extended temperature range of -40°C to 100°C.

Key Features

• Core Logic — 67,000 logic elements for implementing complex control, datapath and glue-logic functions.
• Embedded Memory — Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) for buffers, FIFOs and packet/data storage.
• I/O Capacity & Packaging — 380 user I/Os in a 672-BBGA (27×27 mm) package; surface-mount mounting for standard board assembly.
• High-speed Serial & Source-Synchronous I/O — ECP3 family includes embedded SERDES and pre-engineered source-synchronous I/O support; family data rates span from hundreds of Mbps up to multiple Gbps per channel.
• DSP Resources — ECP3 architecture provides sysDSP capabilities and dedicated multiplier resources suitable for multiply-accumulate and signal-processing tasks.
• Clocking — Family-level support for multiple PLLs and DLLs to manage clock generation and deskewing for complex systems.
• Power — 1.14 V to 1.26 V core voltage supply range for the device.
• Temperature & Grade — Industrial grade device rated for -40°C to 100°C operation.
• Compliance — RoHS compliant.

Typical Applications

• Communications & Networking — Protocol bridging, packet buffering and interface adaptation using high I/O count and on-chip memory.
• Video & Imaging — Real-time datapath processing and buffering leveraging embedded memory and DSP resources.
• Industrial Control — Deterministic I/O, signal conditioning and control logic across extended temperature ranges.
• High-speed Serial Interfaces — Implement SERDES-based links and source-synchronous interfaces for serial protocols supported by the ECP3 family.

Unique Advantages

• High logic density: 67,000 logic elements reduce external glue logic and allow larger functions to be implemented on a single device.
• Substantial on-chip memory: Approximately 4.53 Mbits of embedded RAM enables large buffers and packet storage without external memory.
• Robust I/O and package: 380 user I/Os in a 672-BBGA package provide flexible interfacing options while maintaining a compact footprint.
• Industrial temperature rating: Specified operation from -40°C to 100°C for reliable performance in demanding environments.
• Family-proven high-speed features: ECP3 family support for SERDES, sysDSP and multiple PLL/DLL resources simplifies design of high-performance subsystems.
• RoHS compliant: Meets environmental requirements for lead-free manufacturing.

Why Choose LFE3-70EA-6FN672I?

This Lattice ECP3 device combines mid-to-high logic capacity, substantial embedded memory and a high I/O count in a 672-BBGA package, making it well suited for communications, imaging, industrial control and other applications that demand integrated DSP and high-speed I/O capabilities. Its industrial temperature rating and RoHS compliance make it appropriate for deployed systems that require robust operation and regulatory alignment.

Because it is part of the ECP3 family, designs benefit from the documented family-level features for serial links, DSP acceleration and flexible clocking, enabling scalable solutions and easier migration across related device densities.

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