LFE3-70EA-6FN1156I

The LFE3-70EA-6FN1156I is an industrial-grade Lattice ECP3 field programmable gate array (FPGA) in a 1156-ball BGA package. It delivers a high-density reconfigurable fabric with 67,000 logic elements, large on-chip RAM, and broad I/O capacity for complex embedded and communications applications.

Designed for system integration and performance, this device supports low-voltage core operation and extended industrial temperature range, making it suitable for demanding designs that require sizable logic, memory and I/O resources in a compact surface-mount package.

Key Features

• Core Capacity — 67,000 logic elements provide substantial LUT-based logic density for mid-to-high complexity FPGA designs.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) for packet buffering, state machines, and local data storage.
• I/O Count — 490 user I/Os to support wide parallel interfaces and multiple high-pin-count peripherals.
• Package & Mounting — 1156-BBGA package (supplier device package: 1156-FPBGA, 35×35 mm) in a surface-mount format for high-density PCB integration.
• Power — Core supply range from 1.14 V to 1.26 V to match low-voltage system power rails.
• Operating Temperature — Industrial temperature grade rated from −40 °C to 100 °C for robust operation in extended environments.
• Industry Compliance — RoHS compliant to meet standard environmental requirements for electronic assemblies.

Typical Applications

• High-density communications — Use the large I/O count and on-chip memory for protocol handling, fronthaul/backhaul, or multi-channel interfaces.
• Signal processing and DSP — Combine logic capacity and embedded RAM for real-time data path implementations and streaming processing tasks.
• Prototyping and system integration — Ideal for integrating multiple functions into a single FPGA to reduce component count and PCB complexity.
• Industrial control systems — Industrial temperature rating and robust I/O make it suitable for factory automation, motion control, and machine vision subsystems.

Unique Advantages

• Substantial logic density: 67,000 logic elements enable consolidation of complex functions onto a single device, simplifying system architecture.
• Significant on-chip RAM: Approximately 4.53 Mbits of embedded memory reduces reliance on external memory for many buffering and queueing needs.
• High I/O scalability: 490 user I/Os allow flexible interfacing with sensors, peripherals, and high-pin-count connectors without external multiplexing.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in thermally challenging environments.
• Compact, manufacturable package: 1156-ball FPBGA (35×35 mm) surface-mount package balances board-level density with thermal and routing considerations.
• Low-voltage core: 1.14–1.26 V supply range aligns with modern low-power system power rails.

Why Choose LFE3-70EA-6FN1156I?

This Lattice ECP3 device combines high logic capacity, substantial embedded memory and a large I/O complement in a single industrial-grade, surface-mount package—offering designers the ability to integrate complex functions while keeping board-level BOM and routing manageable. Its low-voltage core and RoHS compliance support modern system requirements and environmental standards.

The LFE3-70EA-6FN1156I is well suited for engineering teams and procurement looking for a proven mid-to-high density FPGA for communications, signal processing, industrial control, and system consolidation projects where reliable operation across an extended temperature range is required.

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