LFE3-70E-8FN672I

The LFE3-70E-8FN672I is a Lattice ECP3 family FPGA offering 67,000 logic elements in a 672-ball BGA package. This programmable logic device combines substantial logic capacity, embedded memory, and plentiful I/O to support mid-to-high density system integration in industrial applications.

Designed for surface-mount board assembly, the device targets applications that require flexible I/O, on-chip embedded memory, and support for high-speed serial lanes while operating across an industrial temperature range and a tight core-voltage window.

Key Features

• Core / Logic — 67,000 logic elements provide broad programmable logic capacity for complex control, signal processing, and glue-logic tasks.
• Embedded Memory — 4,526,080 total RAM bits (approximately 4.53 Mbits) of on-chip memory to support buffering, FIFOs, and local data storage without external RAM.
• I/O and Package — 380 user I/Os in a 672-BBGA (672-FPBGA, 27 × 27 mm) surface-mount package for high pin-count designs and dense board layouts.
• Voltage & Power — Core supply range of 1.14 V to 1.26 V, enabling predictable power design and integration with 1.2 V domains.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant for commercial manufacturing.
• High-speed Serial and I/O Support (Family Features) — ECP3 family supports embedded SERDES with data rates from 150 Mbps to 3.2 Gbps and, in the 672-package configuration, provides multiple SERDES channels for protocol and link integration.
• sysDSP and Arithmetic Resources (Family Features) — Includes the sysDSP slice architecture described in the ECP3 family datasheet for high-performance multiply and accumulate operations and advanced ALU capabilities.
• Clocking and Timing — Family-level support includes on-chip PLLs and DLLs to manage system clocks and high-speed interface timing.
• Flexible Configuration (Family Features) — ECP3 configuration options cited in the family datasheet include SPI boot interfaces and dual-boot capability for field updates and robust configuration management.

Typical Applications

• Industrial Control — Implement deterministic control logic, sensor aggregation, and protocol conversion within industrial automation systems, leveraging the device’s industrial temperature rating and high I/O count.
• Communications and Networking — Use on-chip SERDES channels and abundant I/O to implement interface bridging, packet buffering, or link adaptation in mid-range network equipment.
• Video and Imaging — Deploy embedded memory and DSP-oriented resources for line buffering, pre-processing, or custom image pipeline tasks.
• Instrumentation and Test — Integrate data capture, preprocessing, and custom digital logic in measurement and test systems that need reliable operation across −40 °C to 100 °C.

Unique Advantages

• High logic density: 67,000 logic elements enable complex designs without moving to larger, more costly device families.
• Substantial on-chip memory: Approximately 4.53 Mbits of embedded memory reduces dependence on external RAM and simplifies PCB routing and BOM.
• Plentiful I/O in a compact package: 380 I/Os in a 27 × 27 mm 672-FPBGA footprint balance high pin count with space-efficient board design.
• Industrial reliability: Rated for −40 °C to 100 °C operation and supplied as an industrial-grade component for robust field deployment.
• Predictable power envelope: Narrow core supply window (1.14 V–1.26 V) simplifies power-supply selection and thermal budgeting.
• Family-level high-speed capability: ECP3 family SERDES and sysDSP features support integration of serial links and DSP tasks where required by the application.

Why Choose LFE3-70E-8FN672I?

The LFE3-70E-8FN672I is positioned for designs that need a strong balance of programmable logic capacity, embedded memory, and a high I/O count within an industrial temperature envelope. Its 672-BBGA footprint and surface-mount mounting make it suitable for compact, production-grade boards that demand integrated memory and SERDES-capable interfaces as described in the ECP3 family datasheet.

Choose this device when your project requires a scalable FPGA option from the ECP3 family with defined core-voltage requirements, comprehensive on-chip resources, and industrial operating range—backed by the documented ECP3 family features for configuration and system integration.

Request a quote or submit an inquiry to start procurement for LFE3-70E-8FN672I and receive pricing and lead-time information.