LFE3-70E-8FN484I

The LFE3-70E-8FN484I is an ECP3 series Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a combination of substantial programmable logic, embedded RAM, and a high I/O count in a compact 484-BBGA surface-mount package.

Key platform attributes include approximately 67,000 logic elements, roughly 4.526 Mbits of on-chip RAM, 295 I/Os, industrial-grade qualification, a supply voltage range of 1.14 V to 1.26 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Programmable Logic Capacity — Approximately 67,000 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 4.526 Mbits of on-chip RAM for buffering, state storage, and data processing.
• I/O Count — 295 available I/Os to support extensive external connectivity and parallel interfaces.
• Package and Mounting — 484-BBGA package (supplier device package: 484-FPBGA, 23×23) with surface-mount mounting for compact board integration.
• Power Supply Range — Voltage supply specified from 1.14 V to 1.26 V to match system power rails.
• Industrial Grade & Temperature Range — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Regulatory Compliance — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High-density I/O designs — Use where large numbers of external signals are required; supported by 295 I/Os for parallel and multi-channel interfaces.
• Memory-centric logic — Suitable for logic that requires embedded storage and buffering, leveraging approximately 4.526 Mbits of on-chip RAM.
• Industrial systems — Targeted for industrial environments that require an industrial-grade FPGA and operation from −40 °C to 100 °C.
• Compact board-level integration — The 484-BBGA surface-mount package enables high-density implementations in space-constrained designs.

Unique Advantages

• High logical capacity: Approximately 67,000 logic elements enable implementation of complex programmable functions without external ASICs.
• Substantial on-chip memory: Approximately 4.526 Mbits of embedded RAM reduces external memory needs and simplifies board design.
• Extensive external connectivity: 295 I/Os provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front ends.
• Industrial-grade robustness: Rated for −40 °C to 100 °C to meet demanding temperature requirements.
• Compact BGA footprint: 484-BBGA (23×23) surface-mount package optimizes PCB area while supporting high pin count.
• RoHS compliant: Meets common environmental and manufacturing requirements for lead-free production.

Why Choose LFE3-70E-8FN484I?

The LFE3-70E-8FN484I delivers a balanced combination of programmable logic density, on-chip memory, and a high I/O complement in an industrial-grade FPGA package. Its electrical and mechanical specifications make it well suited for designs that demand significant logic resources and connectivity while maintaining a compact board footprint.

This device is appropriate for engineers and procurement teams building systems that require scalable logic capacity, embedded RAM, and reliable operation across a wide temperature range. Its feature set supports consolidation of functions onto a single FPGA to reduce BOM complexity and simplify system architecture.

Request a quote for LFE3-70E-8FN484I today to begin procurement or to receive pricing and availability information for your design requirements.