LFE3-70E-8FN1156C

The LFE3-70E-8FN1156C is an ECP3-family Field Programmable Gate Array (FPGA) offered in a 1156-ball BGA package for surface-mount assembly. It provides a high-density programmable logic fabric with extensive I/O and embedded memory, intended for commercial electronic designs requiring configurable digital logic.

Key on-chip resources include approximately 67,000 logic elements, roughly 4.5 Mbits of embedded RAM, and 490 user I/O pins, supporting integration of complex, custom digital functions within a compact 1156-BBGA footprint.

Key Features

• Logic Capacity  Approximately 67,000 logic elements suitable for implementing complex combinational and sequential logic structures.
• Embedded Memory  Approximately 4.5 Mbits of on-chip RAM for buffering, LUT-based storage, and small-scale memory structures.
• I/O Density  490 user I/O pins to support multiple parallel interfaces, external memory connections, and broad signal routing.
• Package & Mounting  1156-BBGA package (supplier device package: 1156-FPBGA, 35×35 mm) designed for surface-mount assembly in compact boards.
• Power Supply  Operates from a core supply range of 1.14 V to 1.26 V, enabling integration with low-voltage power domains.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial-environment deployments.
• Regulatory Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Custom digital logic  Implement application-specific processing, state machines, and control logic leveraging approximately 67,000 logic elements.
• Interface bridging and protocol conversion  Use plentiful I/O and on-chip memory to connect and translate between multiple digital interfaces.
• Prototyping and development platforms  Deploy as a configurable platform for validating digital architectures and iterative hardware development.
• Embedded control and system integration  Consolidate peripheral control, timing, and glue logic in a single FPGA to reduce BOM and PCB area.

Unique Advantages

• High logic density: Approximately 67,000 logic elements provide the capacity to implement complex custom functions without external glue logic.
• Substantial on-chip memory: Around 4.5 Mbits of embedded RAM supports buffering and local storage needs, reducing dependence on external memory.
• Extensive I/O count: 490 user I/O pins accommodate multiple interfaces and parallel connections, simplifying board-level routing.
• Compact BGA package: 1156-BBGA (35×35 mm supplier FPBGA) enables a high-pin-count solution in a space-efficient footprint for dense board designs.
• Commercial operating range: Rated 0 °C to 85 °C to align with standard commercial product requirements.
• RoHS compliant: Supports environmentally driven manufacturing and assembly processes.

Why Choose LFE3-70E-8FN1156C?

The LFE3-70E-8FN1156C combines substantial programmable logic, significant embedded memory, and a high I/O count in a single 1156-BBGA surface-mount package, offering a compact, integrated building block for commercial embedded designs. Its electrical and thermal specifications enable designers to consolidate multiple discrete functions into one configurable device, simplifying system architecture and reducing component count.

This FPGA is well suited for engineers and OEMs seeking a scalable, programmable solution for custom digital logic, interface consolidation, and prototyping in commercial-temperature products. The combination of logic capacity, on-chip RAM, and broad I/O provides long-term design flexibility and the ability to adapt hardware functions without major PCB redesigns.

If you would like pricing, availability, or to request a quote for the LFE3-70E-8FN1156C, please submit a request and our team will respond with the next steps.