LFE3-70EA-6FN672C

The LFE3-70EA-6FN672C is an ECP3 FPGA from Lattice Semiconductor Corporation designed for commercial applications. It delivers 67,000 logic elements, approximately 4.5 Mbits of embedded memory, and up to 380 I/O in a compact 672-BBGA package.

This device targets commercial embedded designs that require reconfigurable logic, substantial on-chip RAM, and a high-density I/O footprint while operating within a low-voltage core range of 1.14 V to 1.26 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic — 67,000 logic elements provide the capacity to implement complex logic functions and custom programmable architectures.
• Embedded Memory — Approximately 4.5 Mbits of on-chip RAM support buffering, packet handling, and local data storage without external memory.
• I/O Density — Up to 380 I/O pins enable broad peripheral and signal interfacing options for complex board-level integration.
• Power — Low-voltage core operation from 1.14 V to 1.26 V helps minimize core power consumption in system designs.
• Package & Mounting — 672-BBGA (supplier device package: 672-FPBGA 27x27) in a surface-mount form factor for compact PCB layouts.
• Operating Conditions — Commercial grade operation with a specified temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting regulatory and environmental requirements for commercial products.

Typical Applications

• Commercial embedded systems — Implement custom logic, data handling, and I/O aggregation in consumer and commercial electronics.
• Prototyping and development — Reconfigurable platform for validating hardware architectures and accelerating time-to-prototype.
• Instrumentation and test equipment — On-chip memory and dense I/O support data acquisition, signal preprocessing, and control logic.

Unique Advantages

• High logic capacity: 67,000 logic elements enable sizable custom logic implementations without immediate external ASIC development.
• Significant on-chip RAM: Approximately 4.5 Mbits of embedded memory reduces dependence on external memory components for many applications.
• Broad I/O support: 380 I/O pins allow flexible interfacing to sensors, peripherals, and board-level buses.
• Compact BGA package: 672-BBGA (672-FPBGA 27x27) delivers high density in a surface-mount footprint suitable for space-constrained PCBs.
• Low-voltage core operation: 1.14 V to 1.26 V core range supports lower power consumption strategies in system designs.
• Commercial-grade and RoHS compliant: Suited for commercial product lines with environmental compliance considerations.

Why Choose LFE3-70EA-6FN672C?

The LFE3-70EA-6FN672C positions itself as a high-capacity, commercially graded FPGA option with substantial logic, on-chip memory, and I/O density in a compact surface-mount BGA package. Its low-voltage core and RoHS compliance make it a practical choice for commercial embedded designs that require reconfigurable logic and integrated memory without expanding board-level complexity.

Designers and procurement teams targeting commercial products that need scalable logic resources, abundant on-chip RAM, and extensive I/O will find this FPGA supports efficient integration and development within the ECP3 family characteristics.

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