LFE3-70EA-6LFN1156C

The LFE3-70EA-6LFN1156C is a Lattice Semiconductor ECP3 family field-programmable gate array (FPGA) in a 1156-ball BGA package. It provides a high-density, reconfigurable logic fabric with 67,000 logic elements and approximately 4.53 Mbits of embedded RAM, tailored for high-performance, cost-sensitive designs that require significant I/O and on-chip memory.

This commercial-grade device supports a wide range of high-speed serial and parallel interfaces and features DSP-optimized resources, making it suitable for communications, video, data-acquisition and general embedded processing applications operating within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 67,000 logic elements to implement complex control, signal processing and protocol logic in a single device.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM (total RAM bits 4,526,080) for buffering, frame storage and on-chip data structures.
• DSP / sysDSP — Enhanced DSP slice architecture for high-performance multiply-accumulate operations, supporting advanced MAC and MMAC operations and cascadable slices for larger DSP chains.
• High-speed Serial I/O — Embedded SERDES support with data-rate capability from 230 Mbps up to 3.2 Gbps per channel for common packet and transport protocols.
• Programmable I/O — 490 user I/Os with broad I/O standard support and source-synchronous I/O features for DDR and high-speed ADC/DAC interfacing.
• Power and Voltage — Core voltage supply range of 1.14 V to 1.26 V for compatibility with the ECP3 family power architecture.
• Package and Mounting — 1156-ball FPBGA package (supplier package 1156-FPBGA, 35 × 35 mm) for surface-mount PCB assembly and high I/O integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Networking & Communications — Implement protocol bridging, packet buffering and SERDES-enabled physical interfaces for Ethernet, packet transport and backhaul links.
• Video & Broadcast — On-chip memory and DSP resources support video framing, protocol conversion and high-speed serial interfaces for broadcast transport formats.
• Data Acquisition & Signal Processing — sysDSP slices and abundant embedded RAM enable real-time filtering, aggregation and preprocessing of ADC/DAC data streams.
• Embedded Systems & Control — High logic density and plentiful I/Os allow consolidation of multiple control and interface functions into a single FPGA-based subsystem.

Unique Advantages

• High logic density: 67,000 logic elements reduce the need for multi-device solutions and simplify board-level design.
• Significant on-chip RAM: Approximately 4.53 Mbits of embedded memory supports large buffers and low-latency data paths without external RAM.
• Dedicated DSP capabilities: sysDSP architecture and multiply-accumulate support accelerate arithmetic-heavy functions and signal processing pipelines.
• Robust I/O count and flexibility: 490 user I/Os and programmable I/O standards enable diverse peripheral interfacing and high-pin-count designs.
• High-speed serial capability: SERDES with per-channel data rates up to 3.2 Gbps enable implementation of modern serial protocols and interconnects.
• RoHS compliant and commercial-grade: Suitable for a wide range of volume production applications within commercial temperature limits.

Why Choose LFE3-70EA-6LFN1156C?

The LFE3-70EA-6LFN1156C brings together a dense logic fabric, substantial embedded memory and advanced DSP and serial I/O features in a single, surface-mount 1156-ball FPGA package. It is positioned for engineers seeking to consolidate complex logic, high-speed interfaces and on-chip processing into a compact, commercial-grade solution.

Customers designing communications, video, data-acquisition or embedded control systems will find the device’s combination of logic capacity, memory and programmable I/O valuable for reducing BOM complexity, accelerating time-to-market and enabling scalable FPGA-based architectures backed by the ECP3 family feature set.

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