LFE3-70EA-6LFN1156I

The LFE3-70EA-6LFN1156I is an industrial-grade FPGA device from the Lattice ECP3 family. It provides a reconfigurable logic fabric with 67,000 logic elements, approximately 4.53 Mbits of on-chip RAM, and support for up to 490 user I/Os in a 1156-pin BGA package.

Built on the LatticeECP3 family architecture, this device is suitable for high-density, low-power system integration in telecommunications, networking and industrial control applications where configurable DSP resources, flexible I/O and industrial temperature operation are required.

Key Features

• Logic Capacity  67,000 logic elements provide substantial local compute resources for combinational and sequential logic implementations.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM supports large buffering, FIFOs and local data storage.
• I/O Density  Up to 490 user I/Os in the 1156-BBGA package enables wide parallel interfaces and extensive board-level connectivity.
• Core Voltage  Low-voltage core operation with a supply range of 1.14 V to 1.26 V for power-efficient operation.
• Industrial Temperature Range  Rated for operation from -40°C to 100°C to meet demanding environmental requirements.
• Package & Mounting  1156-BBGA (supplier package listed as 1156-FPBGA, 35×35 mm) in a surface-mount form factor for high-density board designs.
• Family-Level Capabilities  As part of the LatticeECP3 family, the device benefits from family features such as embedded SERDES, sysDSP slices, flexible memory resources, and multiple PLL/DLL options (family-level features described in the ECP3 data sheet).
• Compliance  RoHS-compliant manufacturing and materials.

Typical Applications

• Networking & Telecom  Protocol bridging, packet processing and interface consolidation where high I/O count and embedded SERDES support are required.
• Video & Broadcast  Timing-critical data paths, frame buffering and interface conversion leveraging on-chip RAM and DSP resources.
• Industrial Control  Real-time control, sensor aggregation and custom logic in systems requiring industrial temperature operation.
• Embedded System Integration  Glue logic, peripheral aggregation and custom accelerators where dense logic and memory reduce external BOM.

Unique Advantages

• High integration density: 67,000 logic elements and ~4.53 Mbits of on-chip RAM reduce dependency on external components and simplify PCB design.
• Wide I/O capability: 490 user I/Os in a 1156-pin BGA footprint provides abundant interface options for complex boards.
• Industrial robustness: Rated -40°C to 100°C and supplied in a surface-mount BGA package suitable for harsh environments.
• Power-efficient core: Narrow core voltage window (1.14 V–1.26 V) supports efficient power budgeting for energy-sensitive designs.
• Proven family architecture: Leverages LatticeECP3 family features—such as sysDSP and SERDES capability—documented in the family data sheet for predictable integration.
• Regulatory-friendly materials: RoHS-compliant construction eases regulatory handling and global deployment.

Why Choose LFE3-70EA-6LFN1156I?

The LFE3-70EA-6LFN1156I places substantial logic and embedded memory into a high-pin-count BGA package, delivering a balance of compute density, I/O bandwidth and industrial operating range. It is well suited to designers who need a flexible, configurable platform for communications, video, industrial control and embedded integration where on-chip memory and plentiful I/O are priorities.

Choosing this FPGA gives access to the LatticeECP3 family architecture and tool ecosystem, enabling scalable design reuse and a predictable upgrade path across other ECP3 devices.

Request a quote or submit an inquiry for the LFE3-70EA-6LFN1156I to discuss availability, pricing and lead times.