LFE3-70EA-6LFN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA

Quantity 327 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8375Number of Logic Elements/Cells67000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-70EA-6LFN484I – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA

The LFE3-70EA-6LFN484I is an ECP3-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It provides a balance of programmable logic capacity, embedded memory, and I/O density for system designers requiring on-chip integration and robust operating range.

With approximately 67,000 logic elements, roughly 4.53 Mbits of embedded memory and 295 I/Os in a 484-ball BGA package, this device targets applications that need substantial programmable logic, embedded RAM and a wide operating temperature range.

Key Features

  • Programmable Logic  Approximately 67,000 logic elements to implement complex logic, state machines and custom datapaths.
  • Embedded Memory  Approximately 4.53 Mbits of on-chip RAM for buffering, FIFOs and local data storage without immediate need for external memory.
  • I/O Density  295 I/O pins to support multiple parallel interfaces, peripheral connections and board-level signal routing.
  • Package  484-ball BGA package (supplier package: 484-FPBGA, 23×23 mm footprint) optimized for high-density board layouts.
  • Power  Core supply range of 1.14 V to 1.26 V to match system power-rail planning and low-voltage digital domains.
  • Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
  • Mounting and Compliance  Surface mount package and RoHS compliant for modern manufacturing and environmental requirements.

Typical Applications

  • Industrial Control  Leverages the industrial temperature range, substantial logic resources and high I/O count for motor control, programmable automation and sensor interfacing.
  • Communications and Networking  High I/O density and on-chip RAM enable protocol bridging, packet buffering and custom interface logic.
  • Signal Processing  Embedded memory and large logic capacity support data path implementation, streaming logic and pre/post-processing tasks.

Unique Advantages

  • Highly integrated logic and memory: The combination of ~67,000 logic elements and approximately 4.53 Mbits of embedded RAM reduces dependence on external components and simplifies board design.
  • Robust I/O capability: 295 I/Os accommodate multiple parallel interfaces, enabling flexible system partitioning and peripheral connectivity.
  • Industrial operating range: Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments.
  • Space-efficient package: 484-ball BGA (484-FPBGA, 23×23) supports high-density layouts while maintaining thermal and electrical performance.
  • Low-voltage core: Core supply range of 1.14 V to 1.26 V aligns with contemporary low-voltage power domains for efficient system integration.
  • Manufacturing ready: Surface-mount package and RoHS compliance ease integration into standard production processes.

Why Choose LFE3-70EA-6LFN484I?

The LFE3-70EA-6LFN484I offers a capable mix of programmable logic, embedded memory and I/O resources within an industrial-grade FPGA package from Lattice Semiconductor Corporation. Its specifications make it suitable for designers needing substantial on-chip resources and reliable operation across a wide temperature range.

This part is well suited for development teams building systems that require scalable logic capacity, significant local memory and high I/O counts without immediate reliance on external components, delivering long-term value through integration and device-level robustness.

Request a quote or submit an inquiry to evaluate the LFE3-70EA-6LFN484I for your next design and receive pricing and availability information tailored to your project needs.

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