LFE3-70EA-6LFN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA |
|---|---|
| Quantity | 327 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8375 | Number of Logic Elements/Cells | 67000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-70EA-6LFN484I – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA
The LFE3-70EA-6LFN484I is an ECP3-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It provides a balance of programmable logic capacity, embedded memory, and I/O density for system designers requiring on-chip integration and robust operating range.
With approximately 67,000 logic elements, roughly 4.53 Mbits of embedded memory and 295 I/Os in a 484-ball BGA package, this device targets applications that need substantial programmable logic, embedded RAM and a wide operating temperature range.
Key Features
- Programmable Logic Approximately 67,000 logic elements to implement complex logic, state machines and custom datapaths.
- Embedded Memory Approximately 4.53 Mbits of on-chip RAM for buffering, FIFOs and local data storage without immediate need for external memory.
- I/O Density 295 I/O pins to support multiple parallel interfaces, peripheral connections and board-level signal routing.
- Package 484-ball BGA package (supplier package: 484-FPBGA, 23×23 mm footprint) optimized for high-density board layouts.
- Power Core supply range of 1.14 V to 1.26 V to match system power-rail planning and low-voltage digital domains.
- Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
- Mounting and Compliance Surface mount package and RoHS compliant for modern manufacturing and environmental requirements.
Typical Applications
- Industrial Control Leverages the industrial temperature range, substantial logic resources and high I/O count for motor control, programmable automation and sensor interfacing.
- Communications and Networking High I/O density and on-chip RAM enable protocol bridging, packet buffering and custom interface logic.
- Signal Processing Embedded memory and large logic capacity support data path implementation, streaming logic and pre/post-processing tasks.
Unique Advantages
- Highly integrated logic and memory: The combination of ~67,000 logic elements and approximately 4.53 Mbits of embedded RAM reduces dependence on external components and simplifies board design.
- Robust I/O capability: 295 I/Os accommodate multiple parallel interfaces, enabling flexible system partitioning and peripheral connectivity.
- Industrial operating range: Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments.
- Space-efficient package: 484-ball BGA (484-FPBGA, 23×23) supports high-density layouts while maintaining thermal and electrical performance.
- Low-voltage core: Core supply range of 1.14 V to 1.26 V aligns with contemporary low-voltage power domains for efficient system integration.
- Manufacturing ready: Surface-mount package and RoHS compliance ease integration into standard production processes.
Why Choose LFE3-70EA-6LFN484I?
The LFE3-70EA-6LFN484I offers a capable mix of programmable logic, embedded memory and I/O resources within an industrial-grade FPGA package from Lattice Semiconductor Corporation. Its specifications make it suitable for designers needing substantial on-chip resources and reliable operation across a wide temperature range.
This part is well suited for development teams building systems that require scalable logic capacity, significant local memory and high I/O counts without immediate reliance on external components, delivering long-term value through integration and device-level robustness.
Request a quote or submit an inquiry to evaluate the LFE3-70EA-6LFN484I for your next design and receive pricing and availability information tailored to your project needs.