LFE3-70EA-7FN1156C

The LFE3-70EA-7FN1156C is a Lattice ECP3 family field programmable gate array (FPGA) device featuring approximately 67,000 logic elements and roughly 4.53 Mbits of embedded memory. Built for applications that require dense logic, flexible I/O and on-chip memory, this commercial-grade, surface-mount device is supplied in a 1156-ball BGA package and supports a wide range of system integration tasks.

This device targets designs that need high I/O counts, DSP-style processing and flexible configuration options while operating within a 1.14 V to 1.26 V core supply range and a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic  Approximately 67,000 logic elements provide substantial LUT-based logic capacity for complex FPGA designs.
• On‑chip Memory  Approximately 4.53 Mbits of embedded RAM (total RAM bits: 4,526,080) to support frame buffers, FIFOs and algorithm state storage.
• I/O and Package  490 user I/Os in a 1156-BBGA (supplier package: 1156-FPBGA, 35×35 mm) surface-mount package for dense board-level connectivity.
• Power and Temperature  Core supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C to match standard commercial deployments.
• High‑Speed Serial and DSP Features  Family-level features include embedded SERDES with multi-hundred Mbps to multi-Gbps capability and a sysDSP architecture for high-performance multiply-accumulate operations suitable for signal processing tasks.
• Clocking and Timing  Multiple PLL and DLL resources are available in the ECP3 family (family documentation shows up to ten PLLs and two DLLs) for flexible clock management and source-synchronous interfaces.
• Flexible Configuration  Family-level configuration options include SPI boot flash support, dual-boot images, slave SPI and TransFR I/O for field updates, plus soft error detect macros.
• System Support  Family documentation references IEEE 1149.1 and IEEE 1532 support, on-chip oscillator, and vendor tools for configuration and visibility (logic analyzer and configuration utilities).
• RoHS Compliant  Device meets RoHS environmental requirements.

Typical Applications

• Telecommunications & Networking  Use embedded SERDES and high I/O density to implement line cards, packet processing, and protocol bridging for Ethernet, SONET/SDH and other serial interfaces.
• High‑Speed Serial Interfaces  Implement SERDES-based links and multi-protocol physical layers where flexible lane counts and on-chip clocking simplify board design.
• DSP and Signal Processing  Leverage sysDSP slices and on-chip RAM for filtering, FFTs, and other multiply-accumulate–heavy algorithms in communications and imaging pipelines.
• Embedded System Integration  Combine logic, memory and abundant I/O to consolidate multiple functions—protocol adapters, control logic and peripheral interfaces—into a single FPGA device.

Unique Advantages

• High Logic Density:  Approximately 67,000 logic elements enable complex, integrated system designs while reducing the need for multiple discrete components.
• Substantial On‑Chip Memory:  About 4.53 Mbits of embedded memory supports large buffering and state storage without external RAM for many applications.
• Large I/O Count in Compact Package:  490 I/Os in a 35×35 mm 1156-BBGA package provide extensive external connectivity while conserving PCB area.
• Flexible Configuration Options:  SPI boot, dual-boot capability and field update support simplify development and in-field maintenance workflows.
• Designed for High‑Speed Interfaces:  Family-level SERDES and robust clocking resources make the device suitable for multi-gigabit serial links and source-synchronous interfaces.
• Commercial-Grade, RoHS Compliant:  Commercial operating range and environmental compliance align with standard volume electronic product requirements.

Why Choose LFE3-70EA-7FN1156C?

The LFE3-70EA-7FN1156C places substantial logic, memory and I/O resources into a single commercial‑grade, surface-mount FPGA package. Its combination of approximately 67,000 logic elements, roughly 4.53 Mbits of embedded memory and 490 I/Os makes it a strong choice for designs that require dense integration of DSP, protocol handling and I/O-rich functions.

Engineers building communication equipment, embedded processing platforms or complex system controllers will find the ECP3 family features—high-speed serial support, flexible clocking and multiple configuration options—helpful for reducing board-level complexity and accelerating development. The device's commercial temperature grading and RoHS compliance support standard production deployments.

Request a quote or submit an inquiry to check current pricing and availability for the LFE3-70EA-7FN1156C and to discuss how it can fit into your next design.