LFE3-70EA-7FN484C

The LFE3-70EA-7FN484C is a member of the Lattice ECP3 FPGA family, optimized for economical, high-volume and high-speed applications using 65 nm technology. This device provides mid-range programmable logic density and flexible I/O resources for communication, signal processing and embedded system designs.

With approximately 67,000 logic elements and roughly 4.53 Mbits of on-chip RAM, the device balances integration and performance in a compact 484-BBGA (23 × 23 mm) surface-mount package, offered as a commercial-grade part with RoHS compliance.

Key Features

• Core Logic  Approximately 67,000 logic elements (logic cells) for mid-range programmable designs.
• Embedded Memory  Total RAM bits: 4,526,080 (approximately 4.53 Mbits) of on-chip memory to support buffers, FIFOs and local data storage.
• I/O Capacity  295 user I/Os suitable for dense peripheral and bus interfacing in a single device.
• Package & Mounting  484-BBGA / supplier device package 484-FPBGA (23 × 23 mm), surface-mount, for compact board integration.
• Power  Core voltage supply range: 1.14 V to 1.26 V to match system power rails and FPGA family requirements.
• Operating Range  Commercial operating temperature: 0 °C to 85 °C.
• Series-Level Connectivity & I/O Features  ECP3 family features include embedded SERDES with high-speed serial link support, pre-engineered source-synchronous I/O, and broad programmable I/O standards for memory and high-speed device interfaces (series-level capabilities documented in the ECP3 family datasheet).
• Regulatory  RoHS compliant.

Typical Applications

• High-speed communications: Implement protocol bridging, packet processing and serial link interfaces leveraging the ECP3 family’s embedded SERDES and robust I/O.
• Video and broadcast systems: Support SMPTE and high-speed video transport interfaces where on-chip logic and memory handle data formatting and buffering.
• Data acquisition and signal processing: Use embedded RAM and logic to implement preprocessing, buffering and interface logic for ADC/DAC front-ends.
• Embedded control and interface aggregation: Consolidate multiple peripheral interfaces and control logic in a single FPGA to reduce BOM and board complexity.

Unique Advantages

• High integration in a compact package: 67,000 logic elements and 295 I/Os in a 484-BBGA (23 × 23 mm) enable dense system functions without a large board footprint.
• Substantial on-chip memory: Approximately 4.53 Mbits of embedded RAM reduces reliance on external memory for many buffering and local storage needs.
• Flexible power implementation: Narrow core voltage range (1.14 V–1.26 V) simplifies power-rail planning for modern systems.
• Designed for high-speed interfaces: Series-level ECP3 features such as embedded SERDES and source-synchronous I/O facilitate implementation of high-throughput serial and memory interfaces.
• Commercial-grade reliability: 0 °C to 85 °C operating range and RoHS compliance make the device suitable for mainstream embedded and communications products.

Why Choose LFE3-70EA-7FN484C?

The LFE3-70EA-7FN484C positions itself as a mid-density FPGA solution that combines substantial logic capacity, significant embedded memory and broad I/O in a compact, surface-mount 484-BBGA package. It is well suited to designers targeting high-volume, high-speed, cost-sensitive applications who need programmable logic, on-chip RAM and flexible interface support from a single device.

Choose this part for designs that require balanced logic density and memory, high I/O count, and the family-level capabilities documented for ECP3 devices. The combination of package density, power characteristics and RoHS compliance supports scalable deployment and streamlined board-level integration.

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