LFE3-70EA-7FN672I

The LFE3-70EA-7FN672I is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's ECP3 family. It provides a high-density programmable logic fabric with 67,000 logic elements and substantial embedded memory, delivered in a compact 672-ball BGA package.

Specified for industrial-grade operation, the device supports a supply voltage range of 1.14 V to 1.26 V, up to 380 I/O pins, and an operating temperature range of −40 °C to 100 °C, making it suitable for temperature-demanding embedded applications requiring dense logic, on-chip RAM, and high I/O count.

Key Features

• Logic Capacity — 67,000 logic elements to implement complex programmable logic, state machines and custom datapaths.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM to store buffers, FIFOs, and lookup data without external memory.
• I/O Count — 380 user I/O pins to connect to a wide range of peripherals and interfaces.
• Power — Operates from a 1.14 V to 1.26 V supply, enabling defined core power conditions for system design.
• Package & Mounting — 672-ball BGA (supplier package: 672-FPBGA, 27×27) in a surface-mount configuration for space-efficient board integration.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet industrial thermal requirements.
• Regulatory Compliance — RoHS compliant for material and environmental conformity.

Unique Advantages

• High integration density: 67,000 logic elements and roughly 4.53 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board area.
• Large I/O count: 380 I/O pins enable direct interfacing to many peripherals and bus connections without external expanders.
• Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact BGA packaging: 672-ball FPBGA (27×27) delivers dense connectivity in a surface-mount form factor for space-constrained PCBs.
• Controlled core supply: Narrow 1.14 V–1.26 V supply window aids predictable power planning and design verification.
• RoHS compliance: Conforms to common environmental/material directives for modern electronics manufacturing.

Why Choose LFE3-70EA-7FN672I?

The LFE3-70EA-7FN672I combines high logic density, substantial embedded RAM, and a large I/O count in a 672-ball BGA package, positioned for industrial applications that require robust thermal performance and compact board integration. Its defined core voltage range and RoHS compliance simplify system design and manufacturing planning.

This FPGA is suitable for engineers and procurement teams seeking a programmable, high-capacity device with industrial temperature capability and a compact surface-mount package, offering scalability and integration for mid-to-high complexity embedded designs.

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