LFE3-70EA-7LFN1156I

The LFE3-70EA-7LFN1156I is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, designed to deliver substantial logic density and on-chip memory in a compact ball-grid array package. It combines 67,000 logic elements with approximately 4.5 Mbits of embedded memory and up to 490 I/Os for complex, I/O-intensive designs.

Engineered for industrial applications, this surface-mount device is offered in a 1156-BBGA (35 × 35 mm) package, supports a core supply range of 1.14 V to 1.26 V, and operates across a -40 °C to 100 °C temperature range. The device is RoHS compliant.

Key Features

• Core Logic Density  67,000 logic elements provide a high-capacity fabric for implementing large-state machines, custom datapaths, and parallel processing blocks.
• Embedded Memory  Approximately 4.5 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• Extensive I/O  Up to 490 user I/Os to accommodate dense interface requirements and multiple high-pin-count peripherals.
• Package and Mounting  1156-BBGA (1156-FPBGA, 35 × 35 mm) surface-mount package for board-level integration where high pin count and compact footprint are required.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and allow controlled power budgeting.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet the environmental demands of industrial systems.
• Regulatory Compliance  RoHS compliant for reduced hazardous substances in manufacturing and assembly.

Typical Applications

• Industrial Control Systems  Designed to operate across an industrial temperature range and deliver large logic capacity and I/O for PLC, motor control, and automation interfaces.
• I/O-Intensive Interfaces  High pin count (490 I/Os) supports designs that require numerous sensor, actuator, or peripheral connections.
• Data Buffering and Custom Processing  Approximately 4.5 Mbits of embedded RAM and 67,000 logic elements enable local buffering and implementation of custom data processing pipelines.

Unique Advantages

• High Logic Capacity: 67,000 logic elements let you consolidate multiple functions into a single FPGA, reducing system complexity and BOM.
• Significant On-Chip Memory: Approximately 4.5 Mbits of embedded RAM reduce dependence on external memory and lower latency for buffering and local storage.
• Large I/O Count: Up to 490 I/Os enable direct connection to many peripherals and interfaces without extensive external multiplexing.
• Industrial-Rated Operation: Specified for -40 °C to 100 °C operation to meet environmental requirements in industrial deployments.
• Compact, High-Pin Package: The 1156-BBGA (35 × 35 mm) package offers a dense pinout for complex designs while maintaining a manageable board footprint.
• RoHS Compliance: Facilitates regulatory and environmental adherence in manufacturing and supply chains.

Why Choose LFE3-70EA-7LFN1156I?

The LFE3-70EA-7LFN1156I positions itself as a high-capacity, industrial-grade FPGA solution that balances large logic resources, substantial embedded memory, and a very high I/O count in a compact BGA package. It is well suited for designs that require integrated, programmable logic and memory close to large numbers of external interfaces while operating in industrial environments.

Backed by Lattice Semiconductor, this device offers a clear hardware foundation for engineers developing complex control, interface, and data-processing systems that need scalable logic, deterministic on-chip memory, and industrial temperature performance.

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