LFE3-70EA-7LFN484I

The LFE3-70EA-7LFN484I is an ECP3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a high logic density fabric with approximately 67,000 logic elements and embedded memory to support complex programmable designs.

With approximately 4.53 Mbits of on-chip RAM, up to 295 I/O pins, low-voltage operation and industrial-grade temperature range, this device is specified for designs that require significant on-chip resources and robust environmental tolerance.

Key Features

• Core Logic  Approximately 67,000 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM providing local storage for buffering, lookup tables and state retention.
• I/O Capacity  Up to 295 I/O pins to support wide connectivity and parallel interfacing requirements.
• Power Supply  Specified operating voltage range of 1.14 V to 1.26 V for core power planning and supply design.
• Package & Mounting  484-BBGA package (supplier pack 484-FPBGA, 23×23) in a surface-mount form factor to fit compact board layouts.
• Temperature Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for demanding environments.
• Regulatory Compliance  RoHS compliant, supporting lead-free and restricted-substance requirements.

Typical Applications

• Industrial Systems  Industrial-grade temperature rating (−40 °C to 100 °C) makes the device suitable for control and automation equipment that must operate across wide thermal ranges.
• I/O-Intensive Designs  Up to 295 I/O pins enable dense external interfacing for systems requiring many parallel or mixed-signal connections.
• Embedded Logic and Memory  Approximately 67,000 logic elements and ~4.53 Mbits of embedded RAM support on-chip data processing, buffering and custom logic implementations.

Unique Advantages

• Substantial Logic Density: Approximately 67,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing external component count.
• On-Chip Memory: Approximately 4.53 Mbits of embedded RAM allow local data storage and fast access for buffering and state machines, minimizing external memory dependency.
• High I/O Count: With up to 295 I/Os, the device supports complex interconnect needs without requiring multiple interface devices.
• Industrial Temperature Range: Rated from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Compact, Surface-Mount Package: 484-BBGA (23×23) package enables high-density PCB designs while retaining robust soldering and mechanical characteristics for surface-mount assembly.
• RoHS Compliant: Meets RoHS requirements for restricted substances, aiding regulatory compliance in assemblies.

Why Choose LFE3-70EA-7LFN484I?

This ECP3 FPGA balances substantial programmable logic capacity, embedded memory and a high I/O count within a compact 484-BBGA surface-mount package. Its low-voltage core supply and industrial temperature rating make it appropriate for designs that demand both resource density and environmental robustness.

The device is well suited to engineering teams and procurement organizations seeking a programmable, on-chip integration point to reduce board-level complexity while maintaining operational range and regulatory compliance. Its combination of logic, memory and I/O provides a scalable platform for moderate-to-complex embedded designs.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE3-70EA-7LFN484I.