LFE3-70EA-8FN1156I

The LFE3-70EA-8FN1156I is an ECP3 family Field Programmable Gate Array from Lattice Semiconductor Corporation designed for high-density logic integration. It combines 67,000 logic elements with approximately 4.5 Mbits of on-chip RAM and up to 490 I/Os, enabling complex, I/O‑rich designs in a compact BGA package.

Built for industrial applications, the device supports surface-mount assembly, operates across a wide temperature range (−40 °C to 100 °C), and runs from a low-voltage supply of 1.14 V to 1.26 V, providing a balance of integration and ruggedness for embedded systems.

Key Features

• Logic Capacity — 67,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 4.5 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage without external memory.
• High I/O Count — Up to 490 programmable I/Os to support dense connectivity and multiple parallel interfaces.
• Package — 1156‑BBGA package with supplier device package 1156‑FPBGA (35×35) for a compact board footprint and reliable BGA mounting.
• Power — Low-voltage core supply range of 1.14 V to 1.26 V suitable for modern low-voltage system domains.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Mounting — Surface mount device optimized for standard PCB assembly flows.
• Compliance — RoHS compliant for global regulatory conformance.

Typical Applications

• High-density I/O systems — Use the 490 I/Os to implement multi-channel interfaces and aggregate signals for communication and control tasks.
• Memory-dependent logic — Approximately 4.5 Mbits of embedded RAM supports buffering, packet processing, and intermediate data storage without relying on external memory.
• Complex digital integration — 67,000 logic elements enable implementation of sizeable custom logic functions, protocol engines, and signal processing pipelines.
• Industrial control and automation — Industrial grade construction and −40 °C to 100 °C operation make the device suitable for control systems and factory-floor electronics.

Unique Advantages

• High functional density: 67,000 logic elements plus on-chip RAM reduce the need for external logic and memory, simplifying board design.
• Extensive connectivity: 490 I/Os provide flexibility to interface with many peripherals, sensors, and high-speed links in a single device.
• Compact BGA package: The 1156‑BBGA (1156‑FPBGA, 35×35) package delivers high pin-count in a space-efficient footprint for dense assemblies.
• Low-voltage core operation: 1.14 V to 1.26 V core supply supports low-power system domains and modern power-rail architectures.
• Industrial readiness: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in demanding environments and production supply chains.

Why Choose LFE3-70EA-8FN1156I?

The LFE3-70EA-8FN1156I positions itself as a high-density, industrial-grade FPGA solution that balances large logic capacity, substantial embedded memory, and a very high I/O count in a compact BGA package. It is well suited for engineers designing systems that require significant on-chip logic, extensive external connectivity, and operation across wide temperature ranges.

Choosing this part offers scalable integration for complex digital designs, reduces external component count through on-chip resources, and provides predictable electrical and thermal characteristics for long-term deployment in embedded and industrial applications.

Request a quote for LFE3-70EA-8FN1156I to check pricing and availability for your project requirements.