LFE3-70EA-7LFN672I

The LFE3-70EA-7LFN672I is an ECP3 family FPGA from Lattice Semiconductor Corporation, offering a balance of logic density, on-chip memory, and I/O capacity in a compact ball-grid array package. It provides approximately 67,000 logic elements and roughly 4.53 Mbits of embedded memory, making it suitable for industrial designs that require substantial programmable logic and local RAM.

With 380 I/O pins, a 672-pin FBGA package, industrial temperature range, and a low-voltage supply window, this device targets applications where integration, reliability, and board-level I/O are important factors.

Key Features

• Core Logic  Approximately 67,000 logic elements supported by 8,375 configurable logic blocks (CLBs), enabling complex programmable logic implementation.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) for buffering, state storage, and local data processing.
• I/O Capacity  380 dedicated I/O pins to support high pin-count interfacing and multiple parallel signal paths.
• Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V for the device core.
• Package and Mounting  672-BBGA package (672-FPBGA, 27 × 27 mm) designed for surface-mount PCB assembly to support dense board layouts.
• Industrial Grade  Rated for industrial operation with an operating temperature range of -40 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Industrial systems that require programmable logic with robust temperature tolerance and a high number of I/Os for sensor and actuator interfacing.
• I/O-Intensive Systems  Applications that need many parallel interfaces or high pin-count routing benefit from the device’s 380 I/O pins and 672-ball FBGA package.
• Embedded Logic and Processing  Designs requiring substantial on-chip RAM and logic resources for local data buffering, control sequencing, or custom peripheral implementation.

Unique Advantages

• High Logic Density: Approximately 67,000 logic elements provide the capacity to implement large or multiple concurrent logic functions on a single device.
• Generous On-Chip Memory: Around 4.53 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful tasks.
• Extensive I/O Resources: 380 I/Os enable complex interfacing and support a wide range of parallel and mixed-signal front-end requirements.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for deployment in demanding environmental conditions.
• Compact High-Pin-Count Package: The 672-FPBGA (27 × 27 mm) delivers high connectivity in a surface-mount form factor suitable for dense PCB designs.
• Low-Voltage Core Operation: Core supply between 1.14 V and 1.26 V supports low-power design considerations where applicable.

Why Choose LFE3-70EA-7LFN672I?

The LFE3-70EA-7LFN672I combines substantial logic resources, multi-megabit on-chip memory, and a high I/O count in an industrial-grade FPGA package from Lattice Semiconductor Corporation. Its electrical and thermal specifications are aligned for designers building industrial and I/O-heavy embedded systems that require a balance of integration and reliability.

Engineers looking for a device with significant programmable capacity, robust temperature tolerance, and a compact 672-ball FBGA footprint will find this part well suited for applications where board-level I/O and local memory are key design drivers.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the LFE3-70EA-7LFN672I.