LFE3-70EA-7LFN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA |
|---|---|
| Quantity | 746 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8375 | Number of Logic Elements/Cells | 67000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-70EA-7LFN484C – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA
The LFE3-70EA-7LFN484C is a commercial-grade FPGA from Lattice Semiconductor's ECP3 family, offering a reconfigurable logic fabric with enhanced DSP and high-speed interface capabilities. It provides approximately 67,000 logic elements, approximately 4.53 Mbits of embedded memory, and 295 user I/Os in a 484-BBGA (23 × 23 mm) surface-mount package.
Designed for system integration where performance, low power core supply, and flexible I/O are priorities, this device supports applications that require DSP acceleration, source-synchronous interfaces and high-speed serial connectivity as described for the ECP3 family.
Key Features
- Core Logic Approximately 67,000 logic elements suitable for mid-to-high complexity FPGA designs.
- Embedded Memory Approximately 4.53 Mbits of on-chip RAM for buffering, packet processing or data staging.
- DSP and sysDSP ECP3 family sysDSP architecture supports high-performance multiply–accumulate operations for signal processing and algorithm acceleration.
- High‑Speed Serial and Source‑Synchronous I/O Family-level support for embedded SERDES and pre‑engineered source synchronous interfaces enables common serial protocols and fast parallel interfaces.
- I/O Density 295 user I/Os provide broad interfacing options for parallel buses, memory interfaces and mixed-signal front-ends.
- Configuration Flexibility ECP3 family configuration features include SPI boot flash interface and support for dual-boot images for field update flexibility.
- Power and Supply Core voltage supply range 1.14 V to 1.26 V to match system power architectures.
- Package and Mounting 484-FPBGA (23 × 23 mm) surface-mount package for high I/O density in a compact footprint.
- Operating Range and Compliance Commercial temperature range 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Communications & Networking: Use for packet processing, SERDES-based links and protocol bridging where high I/O and DSP resources speed system-level integration.
- Broadcast & Video Transport: Implement video interface logic, framing and buffering using the device's embedded memory and DSP capabilities.
- Wireless Infrastructure: Offload signal processing and interface aggregation in baseband and fronthaul equipment leveraging DSP slices and source-synchronous I/O.
- Test & Measurement: Build custom logic for data capture, real-time processing and high-speed interfacing using abundant I/O and on-chip RAM.
Unique Advantages
- High integration density: Approximately 67,000 logic elements and 295 I/Os reduce external logic and simplify system designs.
- Substantial on‑chip memory: Approximately 4.53 Mbits of embedded RAM enables large buffers and local data processing without external memory.
- Flexible I/O and serial capabilities: Family-level SERDES and source-synchronous support ease adoption of common serial protocols and high-speed parallel interfaces.
- Compact, high-density package: 484-BBGA (23 × 23 mm) delivers significant I/O count in a space-efficient footprint for board-level integration.
- Commercial grade with RoHS compliance: Designed for mainstream electronics environments and regulatory compliance.
- Configurable boot and update options: SPI boot interface and dual-boot support help enable field updates and flexible system initialization strategies.
Why Choose LFE3-70EA-7LFN484C?
The LFE3-70EA-7LFN484C positions itself as a versatile, mid-to-high density FPGA that balances logic capacity, embedded memory and I/O density in a compact 484-BBGA package. Its combination of approximately 67,000 logic elements, roughly 4.53 Mbits of on-chip RAM and broad I/O count makes it well suited for communications, video, and embedded processing applications that require system-level integration without excessive external components.
Backed by the ECP3 family architecture, this device provides DSP-oriented resources, flexible configuration options and support for high-speed serial and source-synchronous interfaces, offering a scalable platform for product lines and iterative designs.
Request a quote or submit an inquiry to purchase the LFE3-70EA-7LFN484C and evaluate how this ECP3 FPGA can meet your design requirements.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016