LFE3-70EA-7LFN484C

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA

Quantity 746 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8375Number of Logic Elements/Cells67000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-70EA-7LFN484C – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA

The LFE3-70EA-7LFN484C is a commercial-grade FPGA from Lattice Semiconductor's ECP3 family, offering a reconfigurable logic fabric with enhanced DSP and high-speed interface capabilities. It provides approximately 67,000 logic elements, approximately 4.53 Mbits of embedded memory, and 295 user I/Os in a 484-BBGA (23 × 23 mm) surface-mount package.

Designed for system integration where performance, low power core supply, and flexible I/O are priorities, this device supports applications that require DSP acceleration, source-synchronous interfaces and high-speed serial connectivity as described for the ECP3 family.

Key Features

  • Core Logic  Approximately 67,000 logic elements suitable for mid-to-high complexity FPGA designs.
  • Embedded Memory  Approximately 4.53 Mbits of on-chip RAM for buffering, packet processing or data staging.
  • DSP and sysDSP  ECP3 family sysDSP architecture supports high-performance multiply–accumulate operations for signal processing and algorithm acceleration.
  • High‑Speed Serial and Source‑Synchronous I/O  Family-level support for embedded SERDES and pre‑engineered source synchronous interfaces enables common serial protocols and fast parallel interfaces.
  • I/O Density  295 user I/Os provide broad interfacing options for parallel buses, memory interfaces and mixed-signal front-ends.
  • Configuration Flexibility  ECP3 family configuration features include SPI boot flash interface and support for dual-boot images for field update flexibility.
  • Power and Supply  Core voltage supply range 1.14 V to 1.26 V to match system power architectures.
  • Package and Mounting  484-FPBGA (23 × 23 mm) surface-mount package for high I/O density in a compact footprint.
  • Operating Range and Compliance  Commercial temperature range 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Communications & Networking: Use for packet processing, SERDES-based links and protocol bridging where high I/O and DSP resources speed system-level integration.
  • Broadcast & Video Transport: Implement video interface logic, framing and buffering using the device's embedded memory and DSP capabilities.
  • Wireless Infrastructure: Offload signal processing and interface aggregation in baseband and fronthaul equipment leveraging DSP slices and source-synchronous I/O.
  • Test & Measurement: Build custom logic for data capture, real-time processing and high-speed interfacing using abundant I/O and on-chip RAM.

Unique Advantages

  • High integration density: Approximately 67,000 logic elements and 295 I/Os reduce external logic and simplify system designs.
  • Substantial on‑chip memory: Approximately 4.53 Mbits of embedded RAM enables large buffers and local data processing without external memory.
  • Flexible I/O and serial capabilities: Family-level SERDES and source-synchronous support ease adoption of common serial protocols and high-speed parallel interfaces.
  • Compact, high-density package: 484-BBGA (23 × 23 mm) delivers significant I/O count in a space-efficient footprint for board-level integration.
  • Commercial grade with RoHS compliance: Designed for mainstream electronics environments and regulatory compliance.
  • Configurable boot and update options: SPI boot interface and dual-boot support help enable field updates and flexible system initialization strategies.

Why Choose LFE3-70EA-7LFN484C?

The LFE3-70EA-7LFN484C positions itself as a versatile, mid-to-high density FPGA that balances logic capacity, embedded memory and I/O density in a compact 484-BBGA package. Its combination of approximately 67,000 logic elements, roughly 4.53 Mbits of on-chip RAM and broad I/O count makes it well suited for communications, video, and embedded processing applications that require system-level integration without excessive external components.

Backed by the ECP3 family architecture, this device provides DSP-oriented resources, flexible configuration options and support for high-speed serial and source-synchronous interfaces, offering a scalable platform for product lines and iterative designs.

Request a quote or submit an inquiry to purchase the LFE3-70EA-7LFN484C and evaluate how this ECP3 FPGA can meet your design requirements.

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