LFE3-70EA-7LFN672C

The LFE3-70EA-7LFN672C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation’s ECP3 family. It delivers a high logic density device with extensive I/O and embedded memory in a compact BGA package suitable for surface-mount assembly.

Designed for commercial-grade applications, this device targets designs that require up to 67,000 logic elements, approximately 4.53 Mbits of embedded memory, and 380 I/O pins, while operating within a low-voltage core range of 1.14 V to 1.26 V.

Key Features

• Core / Logic Provides 67,000 logic elements for mid- to high-density programmable logic implementations.
• Embedded Memory Approximately 4.53 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
• I/O Capacity 380 user I/O pins to support wide parallel interfaces, multiple serial links, or mixed-signal front-end coupling.
• Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V to match low-voltage system domains.
• Package & Mounting 672-ball BGA package (672-BBGA / supplier package: 672-FPBGA, 27×27) in a surface-mount form factor for compact board designs.
• Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Compliance RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

• High-density logic implementations Use the device where designs require a large number of programmable logic elements for custom processing or control logic.
• Memory-intensive functions Leverage approximately 4.53 Mbits of embedded RAM for buffering, packet storage, or local data queues.
• High I/O interface hubs Deploy the device in systems needing substantial pin counts to aggregate multiple peripherals or parallel interfaces.
• Compact board-level solutions The 672-ball BGA surface-mount package suits space-constrained PCBs that require high density in a small footprint.

Unique Advantages

• High logic capacity: 67,000 logic elements provide designers with abundant programmable resources for complex functions without multiple devices.
• Significant on-chip RAM: Approximately 4.53 Mbits of embedded memory reduces the need for external RAM in many buffering or temporary-storage use cases.
• Extensive I/O availability: 380 I/O pins allow flexible interfacing to sensors, peripherals, and high-pin-count buses.
• Low-voltage core operation: A narrow 1.14 V to 1.26 V supply range aligns with low-voltage system architectures and helps simplify power-domain planning.
• Compact, manufacturable package: The 672-BBGA (672-FPBGA, 27×27) surface-mount package supports dense board layouts while maintaining manufacturability.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant, suitable for a wide range of commercial electronic products.

Why Choose LFE3-70EA-7LFN672C?

The LFE3-70EA-7LFN672C positions itself as a high-capacity, commercial-grade FPGA option that balances logic density, embedded memory, and I/O count within a compact BGA package. Its low-voltage core and surface-mount form factor make it appropriate for designs that require substantial programmable resources without expanding PCB footprint or external memory requirements.

This device is well suited for engineering teams building mid- to high-density programmable logic systems that need scalable resources, supportable documentation from the manufacturer, and RoHS-compliant components for commercial product lines.

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