LFE3-70EA-8FN484C

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA

Quantity 750 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8375Number of Logic Elements/Cells67000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-70EA-8FN484C – ECP3 Field Programmable Gate Array (FPGA)

The LFE3-70EA-8FN484C from Lattice Semiconductor is an ECP3-series FPGA in a 484-ball fine-pitch BGA package designed for mid-range system integration. It delivers 67,000 logic elements, approximately 4.53 Mbits of embedded memory, and up to 295 user I/Os for applications requiring a balanced mix of logic density, on-chip memory and high-speed I/O.

Targeted at communications, video/broadcast and high-performance embedded applications, this commercial-grade device combines the ECP3 family’s DSP, SERDES and flexible I/O capabilities with a 1.14 V to 1.26 V core supply and a 0 °C to 85 °C operating range.

Key Features

  • Core Logic  67,000 logic elements provide substantial programmable logic capacity for mid-density designs.
  • On‑Chip Memory  Total RAM bits: 4,526,080 (approximately 4.53 Mbits) to support embedded buffers, FIFOs and data storage.
  • I/O and SerDes  295 user I/Os and ECP3-family embedded SERDES channels (family supports multi-gigabit SERDES up to 3.2 Gbps) for high-speed serial and parallel interfaces.
  • sysDSP and Arithmetic  ECP3 family sysDSP architecture provides optimized slices for multiply-accumulate and high-performance DSP functions (family-level feature).
  • Clocking and PLLs/DLLs  ECP3 family supports multiple PLLs and DLLs for flexible clocking (ECP3-70 family-level provision of up to 10 PLLs and 2 DLLs).
  • Package and Mounting  484-FPBGA (23 × 23 mm) package, surface-mount mounting for compact board designs.
  • Power  Core voltage supply range 1.14 V to 1.26 V; family specifies a 1.2 V core power supply.
  • Commercial Grade and Temperature  Grade: Commercial; operating temperature range 0 °C to 85 °C.
  • Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

  • High‑Speed Networking & Communications  Implement protocol engines and SERDES-based links such as Ethernet, PCIe and other serial interfaces supported by the ECP3 family.
  • Video and Broadcast Processing  Use the device’s DSP capabilities and abundant I/O to handle SMPTE/serial video interfaces and real‑time processing pipelines.
  • Embedded Processing and Control  Deploy as a system controller or custom peripheral offload in embedded platforms requiring moderate logic density and on‑chip memory.
  • Custom High‑Speed Interfaces  Leverage the 295 I/Os and family SERDES to implement custom data converters, high‑speed ADC/DAC interfaces or multi-channel serial links.

Unique Advantages

  • Balanced Logic and Memory:  67,000 logic elements combined with approximately 4.53 Mbits of embedded memory enable complex control, buffering and processing on a single device.
  • High I/O Count:  295 user I/Os allow dense parallel interfaces and flexible pin assignments to match diverse board-level requirements.
  • Family-Level High‑Speed SerDes:  ECP3 family SERDES support multi‑gigabit serial links (up to 3.2 Gbps family-level), enabling integration of modern high‑speed serial protocols.
  • Flexible Clocking and DSP:  Family features such as multiple PLLs/DLLs and sysDSP slices simplify implementation of signal processing and precise clock domains.
  • Compact Package:  484‑ball FPBGA (23 × 23 mm) provides a compact form factor for space-constrained designs while delivering a high pin count.
  • Commercial Availability and Compliance:  Commercial-grade temperature range and RoHS compliance support standard production requirements.

Why Choose LFE3-70EA-8FN484C?

The LFE3-70EA-8FN484C positions itself as a mid-range FPGA solution that combines substantial logic density, multi-megabit on‑chip memory and a high I/O count in a compact 484‑FPBGA package. Its ECP3-family architecture brings DSP-oriented slices, flexible clocking and high-speed SERDES capabilities suitable for communications, video and embedded applications that require integrated processing and interface support.

Designers and procurement teams seeking a commercially graded FPGA with verified family-level features and a balanced mix of logic, memory and I/O will find the LFE3-70EA-8FN484C a practical choice for scalable, performance‑oriented system designs.

Request a quote or submit a pricing inquiry today to receive availability and lead‑time information for the LFE3-70EA-8FN484C.

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