LFE3-70EA-8FN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA |
|---|---|
| Quantity | 750 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8375 | Number of Logic Elements/Cells | 67000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-70EA-8FN484C – ECP3 Field Programmable Gate Array (FPGA)
The LFE3-70EA-8FN484C from Lattice Semiconductor is an ECP3-series FPGA in a 484-ball fine-pitch BGA package designed for mid-range system integration. It delivers 67,000 logic elements, approximately 4.53 Mbits of embedded memory, and up to 295 user I/Os for applications requiring a balanced mix of logic density, on-chip memory and high-speed I/O.
Targeted at communications, video/broadcast and high-performance embedded applications, this commercial-grade device combines the ECP3 family’s DSP, SERDES and flexible I/O capabilities with a 1.14 V to 1.26 V core supply and a 0 °C to 85 °C operating range.
Key Features
- Core Logic 67,000 logic elements provide substantial programmable logic capacity for mid-density designs.
- On‑Chip Memory Total RAM bits: 4,526,080 (approximately 4.53 Mbits) to support embedded buffers, FIFOs and data storage.
- I/O and SerDes 295 user I/Os and ECP3-family embedded SERDES channels (family supports multi-gigabit SERDES up to 3.2 Gbps) for high-speed serial and parallel interfaces.
- sysDSP and Arithmetic ECP3 family sysDSP architecture provides optimized slices for multiply-accumulate and high-performance DSP functions (family-level feature).
- Clocking and PLLs/DLLs ECP3 family supports multiple PLLs and DLLs for flexible clocking (ECP3-70 family-level provision of up to 10 PLLs and 2 DLLs).
- Package and Mounting 484-FPBGA (23 × 23 mm) package, surface-mount mounting for compact board designs.
- Power Core voltage supply range 1.14 V to 1.26 V; family specifies a 1.2 V core power supply.
- Commercial Grade and Temperature Grade: Commercial; operating temperature range 0 °C to 85 °C.
- Compliance RoHS compliant for environmental and manufacturing requirements.
Typical Applications
- High‑Speed Networking & Communications Implement protocol engines and SERDES-based links such as Ethernet, PCIe and other serial interfaces supported by the ECP3 family.
- Video and Broadcast Processing Use the device’s DSP capabilities and abundant I/O to handle SMPTE/serial video interfaces and real‑time processing pipelines.
- Embedded Processing and Control Deploy as a system controller or custom peripheral offload in embedded platforms requiring moderate logic density and on‑chip memory.
- Custom High‑Speed Interfaces Leverage the 295 I/Os and family SERDES to implement custom data converters, high‑speed ADC/DAC interfaces or multi-channel serial links.
Unique Advantages
- Balanced Logic and Memory: 67,000 logic elements combined with approximately 4.53 Mbits of embedded memory enable complex control, buffering and processing on a single device.
- High I/O Count: 295 user I/Os allow dense parallel interfaces and flexible pin assignments to match diverse board-level requirements.
- Family-Level High‑Speed SerDes: ECP3 family SERDES support multi‑gigabit serial links (up to 3.2 Gbps family-level), enabling integration of modern high‑speed serial protocols.
- Flexible Clocking and DSP: Family features such as multiple PLLs/DLLs and sysDSP slices simplify implementation of signal processing and precise clock domains.
- Compact Package: 484‑ball FPBGA (23 × 23 mm) provides a compact form factor for space-constrained designs while delivering a high pin count.
- Commercial Availability and Compliance: Commercial-grade temperature range and RoHS compliance support standard production requirements.
Why Choose LFE3-70EA-8FN484C?
The LFE3-70EA-8FN484C positions itself as a mid-range FPGA solution that combines substantial logic density, multi-megabit on‑chip memory and a high I/O count in a compact 484‑FPBGA package. Its ECP3-family architecture brings DSP-oriented slices, flexible clocking and high-speed SERDES capabilities suitable for communications, video and embedded applications that require integrated processing and interface support.
Designers and procurement teams seeking a commercially graded FPGA with verified family-level features and a balanced mix of logic, memory and I/O will find the LFE3-70EA-8FN484C a practical choice for scalable, performance‑oriented system designs.
Request a quote or submit a pricing inquiry today to receive availability and lead‑time information for the LFE3-70EA-8FN484C.