LFE3-70EA-8LFN1156C

The LFE3-70EA-8LFN1156C is a Lattice ECP3 family field programmable gate array (FPGA) packaged in a 1156-ball BGA. It combines a high logic density fabric with embedded memory and high-speed serial and source-synchronous I/O capabilities to address mid-range, high-speed, cost-sensitive system designs.

Targeted use cases include communications and networking, high-performance embedded processing, and mixed-signal interface applications where integration, on-chip memory, and flexible I/O support are critical to reduce board-level complexity.

Key Features

• Core Logic — Approximately 67,000 logic elements provide substantial capacity for glue logic, protocol handling, and custom datapaths.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM for buffering, packet storage, and state machines.
• High I/O Count — 490 user I/Os in a 1156-ball FPBGA package to support dense external connectivity and multi-interface designs.
• Embedded SERDES and High-speed Interfaces — Family-level support for embedded SERDES channels (data rates to 3.2 Gbps per channel) and multiple channel configurations for serial protocols and high-speed links.
• sysDSP and Multiplier Resources — Enhanced DSP-oriented slice architecture and multiple multiplier configurations (table-level family support) for accelerated MAC and signal processing functions.
• Flexible sysI/O™ Buffer and Standards Support — On-chip termination and broad I/O standard support for LVTTL, LVCMOS, LVDS, SSTL/HSTL families and other source-synchronous interfaces (as defined by the ECP3 family).
• Clocking and Timing — Multiple PLLs and DLLs provided at the family level for robust clock management and source-synchronous operation.
• Configuration and System Support — Flexible device configuration options including SPI boot, dual-boot image support, and system utilities present in the ECP3 family for field updates and debug.
• Power and Mounting — Core voltage supply range of 1.14 V to 1.26 V and surface-mount 1156-FPBGA (35 × 35 mm) package for standard assembly flows.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature suitable for commercial applications.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Communications & Networking — Implements protocol engines and high-speed serial links (PCIe, Ethernet, CPRI-style interfaces) using embedded SERDES and abundant I/O.
• Video and Broadcast Interfaces — Supports high-speed serial video transport and SMPTE-style links with on-chip memory for frame buffering and timing management.
• High-Performance Embedded Processing — Accelerates DSP workloads and custom datapaths with sysDSP resources and hardware multipliers.
• Memory Interface and Interface Bridging — Source-synchronous I/O, DDR/DDR2/DDR3 support features, and on-chip RAM enable memory controller and interface bridge implementations.

Unique Advantages

• High Logic Density: Approximately 67,000 logic elements enable complex system integration on a single device, reducing board-level BOM and interconnect.
• Substantial On-Chip Memory: Approximately 4.53 Mbits of embedded RAM minimizes external memory dependency for buffering and state retention.
• Extensive I/O and Package Integration: 490 I/Os in a 1156-ball FPBGA package support multiple interfaces and dense connectivity without adding external translators.
• Built-in High-speed Serial Capability: Embedded SERDES channels and family-level support for up to 3.2 Gbps per channel enable multi-gigabit link implementation.
• Flexible Configuration and System Tools: Dual-boot, SPI boot options, and family-provided system-level utilities facilitate field updates, debugging, and system integration.
• Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation with RoHS compliance for standard commercial product deployments.

Why Choose LFE3-70EA-8LFN1156C?

The LFE3-70EA-8LFN1156C delivers a balance of logic capacity, embedded memory, and high I/O density in a single-package FPGA tailored for mid-range, high-speed, cost-sensitive applications. Its family-level features—such as enhanced DSP slices, embedded SERDES, and flexible sysI/O support—help reduce system complexity while enabling robust interface and processing functions on-chip.

This device is well suited to designers building communications, multimedia, and embedded processing systems that benefit from integrated memory, abundant I/O, and proven configuration and debug utilities offered within the ECP3 family.

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