LFE3-70EA-8LFN672C

The LFE3-70EA-8LFN672C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial-grade applications. It delivers a combination of logic capacity, embedded memory, and I/O density in a compact 672-ball BGA package.

With 67,000 logic elements, approximately 4.53 Mbits of on-chip RAM and 380 user I/Os, this device targets commercial electronic systems that require programmable logic, significant interface count, and surface-mount packaging.

Key Features

• Core Logic  67,000 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 4.53 Mbits of total on-chip RAM to support buffering, state storage, and intermediate data processing within the FPGA fabric.
• I/O Density  380 user I/Os enable extensive external device interfacing and high pin-count system integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system domains and power architectures.
• Package & Mounting  672-BBGA supplier package (672-FPBGA, 27×27) in a surface-mount form factor for compact board integration.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C to meet standard commercial-environment requirements.
• Environmental Compliance  RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• Commercial Embedded Systems  Use the device's 67,000 logic elements and 380 I/Os to implement control, protocol handling, and custom logic in commercial products.
• Interface and I/O Aggregation  High I/O count supports designs that consolidate multiple interfaces or bridge between subsystems on a single FPGA.
• Prototyping and Development  Provides a substantial logic and memory resource set for evaluating and validating system-level FPGA architectures in a commercial development context.

Unique Advantages

• High Logic Capacity: 67,000 logic elements enable implementation of complex custom logic without immediate reliance on multiple devices.
• Integrated Memory: Approximately 4.53 Mbits of embedded RAM reduces the need for some external memory components and simplifies data handling within the design.
• Extensive I/O Support: 380 I/Os allow dense connectivity for multi-interface designs and peripheral integration.
• Compact, Surface-Mount Package: 672-BBGA (672-FPBGA, 27×27) package provides a space-efficient footprint for PCBs where board area is constrained.
• Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial product requirements.
• Low-Voltage Core: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage system rails.

Why Choose LFE3-70EA-8LFN672C?

The LFE3-70EA-8LFN672C combines substantial logic density, meaningful on-chip memory, and a high number of I/Os in a compact BGA package, making it well suited for commercial designs that require programmable logic and extensive interfacing. Its commercial temperature rating and RoHS compliance support mainstream product development and manufacturing.

Backed by Lattice Semiconductor Corporation, this FPGA is positioned for customers and designs that need scalable programmable logic resources with a focus on integration, board-level space efficiency, and standard commercial operating conditions.

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