LFE3-70EA-9FN1156C

The LFE3-70EA-9FN1156C is an FPGA device from the LatticeECP3 family, offering a reconfigurable SRAM-based fabric optimized for integration of DSP, memory, and I/O functions. This device combines 67,000 logic elements with embedded memory and a wide I/O complement for use in high-volume, high-speed, and cost-sensitive system designs.

Targeted for applications requiring substantial logic density, embedded RAM, and flexible I/O, the part delivers system-level capabilities drawn from the ECP3 family, including sysDSP slices, embedded SERDES support, and programmable I/O standards while operating over a 1.14 V to 1.26 V core supply and a commercial temperature range.

Key Features

• Core Logic 67,000 logic elements for implementing complex control, data-path, and signal-processing functions.
• Embedded Memory Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) to support frame buffering, FIFOs, and local data storage.
• I/O Capacity & Flexibility 490 user I/Os to accommodate wide parallel buses, multi-protocol interfaces, and dense board-level connectivity.
• Packaging Supplied in a 1156-BBGA package (supplier package: 1156-FPBGA, 35 × 35 mm) for high I/O count and board-level routing options.
• Power & Temperature Core supply range of 1.14 V to 1.26 V and commercial operating temperature of 0 °C to 85 °C.
• Family-Level Capabilities Leverages LatticeECP3 family features such as embedded SERDES channels, sysDSP slice architecture, sysMEM embedded block RAM, and sysCLOCK PLL/DLL resources as described in the family datasheet.
• Mounting & Compliance Surface-mount device with RoHS-compliant status for modern manufacturing processes.

Typical Applications

• High-speed serial and networking interfaces — Use the ECP3 family’s SERDES and configurable I/O to implement protocol bridging or multi-protocol front ends in communications equipment.
• Digital signal processing — Implement DSP kernels and data-path acceleration using the device’s large logic count and the ECP3 sysDSP architecture.
• Memory interface and buffering — On-chip RAM and source-synchronous I/O features support high-throughput buffering and external memory interfaces.
• Embedded control and glue logic — Replace multiple discrete components with a single, reconfigurable device for system control, interface consolidation, and custom logic.

Unique Advantages

• High logic density: 67,000 logic elements provide capacity for complex FPGAs designs without splitting functionality across multiple devices.
• Significant on-chip RAM: Approximately 4.53 Mbits of embedded memory reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O count: 490 user I/Os enable broad connectivity and simplify board-level routing for multi-channel applications.
• Family-level signal and DSP features: Built on the LatticeECP3 family, the device benefits from SERDES, sysDSP, and PLL/DLL resources described in the family datasheet.
• Commercial-grade readiness: Surface-mount package and 0 °C to 85 °C operating range match common commercial product requirements.
• RoHS-compliant: Conforms to RoHS for lead-free assembly processes.

Why Choose LFE3-70EA-9FN1156C?

The LFE3-70EA-9FN1156C positions itself as a high-density, system-oriented FPGA within the LatticeECP3 family, combining sizable logic resources, embedded RAM, and a large I/O complement in a 1156-BBGA footprint. It is well suited for designers who need to consolidate logic, memory buffering, and multi-protocol I/O into a single, reconfigurable device while operating within a commercial temperature range.

Choosing this device provides a path to scalable designs that leverage family-level DSP and SERDES capabilities, supported by documented LatticeECP3 architecture features. It is appropriate for engineering teams targeting high-volume or cost-sensitive applications that require substantial on-chip resources and flexible interfacing options.

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