LFE3-70EA-8LFN484C

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA

Quantity 1,119 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8375Number of Logic Elements/Cells67000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-70EA-8LFN484C – ECP3 FPGA, 67,000 Logic Elements, 295 I/O, 484-BBGA

The LFE3-70EA-8LFN484C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a defined combination of logic capacity, embedded memory and high I/O density in a surface-mount 484-BBGA package for commercial-grade designs.

With 67,000 logic elements, approximately 4.53 Mbits of on-chip RAM and 295 general-purpose I/O, this device targets applications that require significant programmable logic and memory resources while operating within a 1.14 V to 1.26 V supply range and 0 °C to 85 °C temperature window.

Key Features

  • Core Logic 67,000 logic elements provide substantial capacity for implementing complex digital functions and custom hardware acceleration.
  • Embedded Memory Approximately 4.53 Mbits of on-chip RAM (Total RAM Bits: 4,526,080) to support buffering, lookup tables and intermediate data storage without immediate need for external memory.
  • I/O Density 295 I/O pins to accommodate extensive peripheral interfacing, high-pin-count buses and multiple concurrent I/O channels.
  • Power Defined supply range of 1.14 V to 1.26 V for core power planning and system integration.
  • Package & Mounting 484-ball BGA in a 484-FPBGA (23×23) format, designed for surface-mount PCB assembly with high pin count in a compact footprint.
  • Temperature Rating Commercial operating range from 0 °C to 85 °C for standard commercial electronics applications.
  • Environmental Compliance RoHS compliant for lead-free manufacturing environments.

Typical Applications

  • High-density digital processing — Implement complex logic blocks and parallel processing functions using the device's 67,000 logic elements and on-chip RAM.
  • I/O-rich system control — Interface with numerous peripherals and buses thanks to 295 available I/O pins, suitable for multi-channel control and bridging tasks.
  • Mid-range embedded acceleration — Use the combination of logic capacity and embedded memory to offload compute-intensive tasks within commercial embedded systems.
  • Prototyping and integration — Evaluate and integrate custom hardware functions where a defined commercial temperature and supply window applies.

Unique Advantages

  • High logic capacity: 67,000 logic elements enable implementation of sizeable digital systems and multiple concurrent functions on a single device.
  • Significant on-chip memory: Approximately 4.53 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage needs.
  • Large I/O complement: 295 I/Os simplify board-level routing and minimize the need for external I/O expanders.
  • Compact high-pin-count package: 484-FPBGA (23×23) offers a dense pinout in a surface-mount form factor for high-performance PCB designs.
  • Clear electrical and environmental specs: Defined supply range (1.14 V–1.26 V), commercial temperature rating (0 °C–85 °C) and RoHS compliance aid specification and procurement processes.

Why Choose LFE3-70EA-8LFN484C?

The LFE3-70EA-8LFN484C is positioned for designs that require a balance of substantial programmable logic, on-chip memory and high I/O count within a commercial-grade FPGA. Its specification set—67,000 logic elements, approximately 4.53 Mbits of embedded RAM, 295 I/O and a 484-BBGA surface-mount package—supports consolidation of functions and streamlined board-level integration.

Provided by Lattice Semiconductor Corporation, this part offers a well-defined hardware footprint and operating envelope for procurement and system engineering teams evaluating FPGA options for mid-to-high density commercial applications.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the LFE3-70EA-8LFN484C FPGA.

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