LFE3-70EA-8FN672C

The LFE3-70EA-8FN672C is a Lattice Semiconductor ECP3 family field programmable gate array (FPGA) packaged in a 672‑ball BGA (27 × 27 mm). It delivers a mid-range combination of programmable logic, embedded memory, and high I/O density suitable for communications, video and general embedded applications.

Built on the ECP3 architecture, this device provides a balance of logic capacity, on‑chip RAM and a broad set of I/O resources—enabling system integration where moderate logic resources, plentiful I/O and configurable interfaces are required.

Key Features

• Logic Capacity — 67,000 logic elements to implement complex RTL, state machines and glue logic in a single device.
• Embedded Memory — 4,526,080 bits of total on‑chip RAM (approximately 4.53 Mbits) for buffering, FIFOs and local data storage.
• I/O and Package — 380 user I/Os in a 672‑BBGA package; supplied as a 672‑FPBGA (27 × 27 mm) surface‑mount package for high pin‑count designs.
• High‑Speed Serial and Source‑Synchronous I/O (family capability) — ECP3 family supports embedded SERDES and pre‑engineered source‑synchronous interfaces for protocols such as PCIe, Ethernet and other serial links (as detailed in the ECP3 family data sheet).
• DSP and Arithmetic Resources (family capability) — sysDSP slice architecture in the ECP3 family provides optimized multiply/accumulate resources for signal processing and compute tasks.
• Clocking Resources (family capability) — Multiple PLLs and DLLs in the ECP3 family for flexible clock management and timing control.
• Power and Operating Range — Core voltage supply range of 1.14 V to 1.26 V; commercial operating temperature range of 0 °C to 85 °C.
• Mounting and Compliance — Surface‑mount device with RoHS compliance for modern assembly processes and environmental conformity.

Typical Applications

• Telecommunications and Networking — Implement protocol bridging, packet processing logic or SERDES‑based links leveraging the ECP3 family’s serial interface capabilities and abundant I/O.
• Video and Broadcast — Support SMPTE/serial video interfaces and source synchronous data paths using on‑chip memory and dedicated I/O features from the ECP3 family.
• Embedded Control and Instrumentation — Provide glue logic, custom peripherals and data buffering for embedded systems that require moderate logic density and extensive I/O.

Unique Advantages

• Highly integrated mid‑range FPGA: 67,000 logic elements combined with approximately 4.53 Mbits of embedded memory reduces external components and board complexity.
• High I/O count in a compact package: 380 user I/Os in a 672‑ball BGA provide plentiful connectivity for multi‑lane interfaces, external memories and peripherals.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching typical commercial product deployment and test environments.
• Flexible power envelope: Narrow core supply range (1.14 V to 1.26 V) that supports consistent power design and rails in system layouts.
• RoHS compliant: Conforms to RoHS requirements for modern manufacturing and regulatory expectations.
• ECP3 family ecosystem: Access to ECP3 family capabilities such as sysDSP slices, PLL/DLL resources and documented serial interface support for design scalability and reuse.

Why Choose LFE3-70EA-8FN672C?

The LFE3-70EA-8FN672C positions itself as a practical, mid‑range FPGA solution for designs that require substantial logic alongside significant embedded memory and a high number of I/Os. Its 672‑ball BGA package and 380 I/Os make it suitable for compact, high‑connectivity boards where on‑chip resources reduce BOM and simplify system routing.

Engineers looking for a cost‑effective FPGA with the ECP3 family’s DSP, SERDES and clocking capabilities will find this device appropriate for communications, video, and embedded control applications that operate within commercial temperature ranges. The device’s RoHS compliance and surface‑mount form factor align with modern production flows and assembly requirements.

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