LFE3-70EA-8FN672I

The LFE3-70EA-8FN672I is an ECP3-series FPGA offering mid-range programmable logic density and extensive I/O in a compact 672-ball BGA package. It combines approximately 67,000 logic elements with multi-megabit embedded RAM and high-speed serial capabilities to support embedded signal processing and high-throughput interface designs.

Designed for industrial applications, this device provides a low-voltage core supply and a wide operating temperature range, making it suitable for demanding environments that require a balance of integration, performance, and reliability.

Key Features

• Logic Fabric  Approximately 67,000 logic elements for mid-range system integration and complex glue-logic or datapath implementations.
• Embedded Memory  Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) to support large buffering, packet processing, and local state storage.
• I/O and High-Speed Serial  380 general-purpose I/Os with family-level embedded SERDES support for high-speed serial links and protocol interfacing (family datasheet specifies serial data rates up to 3.2 Gbps per channel).
• DSP and Math Acceleration  ECP3 family sysDSP architecture with a large complement of 18×18 multipliers (family-level resources enable robust multiply-accumulate performance for signal processing tasks).
• Package & Mounting  672-BBGA package (supplier device package: 672-FPBGA, 27 × 27 mm) with surface mount assembly for compact board designs.
• Power & Temperature  Core supply range 1.14 V to 1.26 V and an industrial operating temperature range of −40 °C to 100 °C.
• Flexible Configuration & System Support  Family-level features include SPI boot flash interface, dual-boot images, on-chip oscillator, and configuration utilities for field updates and design debugging.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-speed Networking & Telecom  Hardware acceleration and protocol bridging where high I/O counts and embedded SERDES support interfaces such as Ethernet, PCI Express, and other serial links.
• Broadcast & Video Transport  Video interface and transport processing leveraging high-speed serial channels and DSP resources for SMPTE and video-related data flows (family-level SMPTE 3G support noted in datasheet).
• Embedded Signal Processing  Local signal conditioning, filtering, and real-time data manipulation using the device's sysDSP slices and multiplier resources.
• Industrial Automation  Control and I/O aggregation in industrial systems that require an extended operating temperature range and robust I/O capacity.

Unique Advantages

• Highly integrated mid-range FPGA:  Combines ~67K logic elements and multiple megabits of embedded RAM to reduce external component count and simplify PCB design.
• Strong serial connectivity:  Built-in SERDES capability at family level enables multi-gigabit serial links for modern communication interfaces.
• On-chip DSP acceleration:  sysDSP architecture and plentiful 18×18 multipliers accelerate common signal processing and MAC-heavy workloads.
• Industrial-ready temperature range:  Rated for −40 °C to 100 °C to meet demanding environmental requirements.
• Compact, manufacturable package:  672-ball BGA (27 × 27 mm) surface-mount package supports dense board layouts while retaining high I/O counts.
• Flexible configuration options:  Supports SPI boot, dual-boot images, and field update mechanisms for easier deployment and in-field upgrades.

Why Choose LFE3-70EA-8FN672I?

The LFE3-70EA-8FN672I positions itself as a versatile mid-range FPGA option within the Lattice ECP3 family, delivering a balanced combination of logic density, embedded memory, DSP resources, and high-speed I/O in a single compact package. Its industrial temperature rating and low-voltage core make it suitable for designs that must operate reliably across varied conditions.

This device is well suited to engineers and product teams building networking, video, or embedded signal processing systems that need integrated serial interfaces and on-chip acceleration, while retaining configuration flexibility for development and field updates.

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