LFE3-70EA-8LFN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA

Quantity 411 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8375Number of Logic Elements/Cells67000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-70EA-8LFN484I – ECP3 FPGA, 67,000 logic elements, 295 I/Os, 484-BBGA

The LFE3-70EA-8LFN484I is an ECP3 family field-programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a reconfigurable FPGA fabric with 67,000 logic elements and approximately 4.53 Mbits of on-chip RAM, targeted at designs that require a balance of integration, DSP capability and flexible I/O.

This device is suited for systems requiring multi-gigabit serial interfaces, advanced memory and DSP resources, and industrial-grade operating conditions. Its packaging and I/O density make it appropriate for high-density board designs that need surface-mount BGA packaging and robust temperature range.

Key Features

  • Core Logic  67,000 logic elements provide a substantial programmable fabric for complex logic, control, and data-path functions.
  • Embedded Memory  Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) for buffering, FIFOs and local storage.
  • DSP and Multiply Resources  Part of the LatticeECP3 family architecture that includes enhanced sysDSP capabilities and dedicated multiplier resources (as described in the family datasheet).
  • High-speed Serial Interfaces (SERDES)  Family-level embedded SERDES support with data rates up to 3.2 Gbps; in the 484-FPBGA package the ECP3-70 device supports the 484-package SERDES/I‑O combination of 4 SERDES channels and 295 user I/Os (per the family datasheet).
  • Programmable I/O  295 user I/Os with programmable sysI/O buffers supporting a wide range of standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI and differential interfaces) as detailed in the family datasheet.
  • Power  Core supply range specified at 1.14 V to 1.26 V.
  • Package & Mounting  484-BBGA package; supplier device package listed as 484-FPBGA (23×23 mm). Surface-mount device for compact board integration.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
  • RoHS Compliance  RoHS-compliant for regulatory and environmental requirements.

Typical Applications

  • Telecom and Networking  Implement protocol bridging, packet processing and multi-gigabit serial links using the device’s SERDES capabilities and programmable I/O.
  • Broadcast & Video  Support for high-speed, source-synchronous interfaces and on-chip memory for video buffering and data alignment tasks.
  • Industrial Control  Industrial-temperature operation and flexible I/O standards make this FPGA suitable for motor control, sensor aggregation and deterministic control functions.
  • Data Acquisition & ADC/DAC Interfaces  Programmable I/O and embedded memory support high-speed data capture, short-term storage and pre-processing near the sensor/ADC front end.

Unique Advantages

  • Substantial Logic Capacity: 67,000 logic elements enable implementation of complex control, signal processing and protocol logic without external glue logic.
  • Integrated Memory: Approximately 4.53 Mbits of on-chip RAM reduces external memory dependency for buffering and tight-latency operations.
  • Flexible High‑Speed I/O: 295 user I/Os and family-level support for a broad set of I/O standards provide interface flexibility across a wide range of peripherals and lanes.
  • Multi‑Gbps SERDES Support: Embedded SERDES with family-specified rates up to 3.2 Gbps and a 484-package configuration that supports four SERDES channels—useful for PCIe, Ethernet and other serial protocols described in the family datasheet.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a surface-mount BBGA package for robust deployments in industrial environments.

Why Choose LFE3-70EA-8LFN484I?

The LFE3-70EA-8LFN484I positions itself as a versatile mid-to-high density FPGA option within the LatticeECP3 family, offering a balance of logic capacity, embedded memory and multi-gigabit serial capability in a compact 484-BBGA surface-mount package. Its programmable I/O and family-level DSP and SERDES features make it well-suited for communications, video, data acquisition and industrial control designs that require integrated processing and flexible interfacing.

For design teams seeking a field-programmable solution with industrial temperature range, substantial on-chip RAM and a high I/O count, this part offers a combination of integration and configurability with the ecosystem and documentation provided in the Lattice ECP3 family datasheet.

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