LFE3-70EA-9FN1156I

The LFE3-70EA-9FN1156I is an ECP3 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for complex digital integration. It provides approximately 67,000 logic elements, roughly 4.526 Mbits of embedded memory, and up to 490 I/O pins in a high-density 1156-BBGA package.

Targeted at industrial applications, this device offers a low-voltage core supply and a wide operating temperature range to support designs that require substantial logic capacity, on-chip memory, and a large I/O count within a surface-mount BGA footprint.

Key Features

• Core Logic  Approximately 67,000 logic elements for implementing large-scale digital logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 4.526 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory in many use cases.
• I/O Density  Up to 490 I/O pins to enable extensive peripheral connectivity and multi-channel interfacing in a single device.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements for the FPGA core.
• Package and Mounting  1156-BBGA (listed as 1156-FPBGA, 35×35) in a surface-mount form factor for compact, high-density PCB implementations.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to support industrial environments and extended-temperature applications.
• RoHS Compliant  Manufactured in compliance with RoHS environmental requirements.

Typical Applications

• Complex digital processing  Implement large-scale logic functions, custom datapaths, and protocol offload engines using the device's ~67k logic elements and embedded memory.
• High-density I/O control  Drive multi-channel interfaces, sensor arrays, and board-level glue logic with up to 490 I/Os in a single FPGA.
• Memory-intensive embedded designs  Use the approximately 4.526 Mbits of on-chip RAM for packet buffering, FIFO structures, or local scratch memory to reduce external memory dependence.
• Industrial systems  Deploy in applications requiring an industrial temperature range (−40 °C to 100 °C) and a surface-mount BGA footprint for robust, compact electronic assemblies.

Unique Advantages

• High logic capacity: The approximately 67,000 logic elements enable consolidation of multiple functions into one FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 4.526 Mbits of embedded RAM supports data buffering and local storage, simplifying memory architecture.
• Extensive I/O: Up to 490 I/Os allow direct interfacing to many peripherals and subsystems without external multiplexing.
• Industrial temperature rating: Operation from −40 °C to 100 °C suits deployments in factory, instrumentation, and outdoor equipment.
• Compact, surface-mount BGA package: The 1156-BBGA (1156-FPBGA, 35×35) package provides high integration density for space-constrained PCB designs.
• RoHS compliant: Designed and manufactured to meet RoHS environmental requirements for modern electronics production.

Why Choose LFE3-70EA-9FN1156I?

The LFE3-70EA-9FN1156I positions itself for designs that require a balance of large logic capacity, significant on-chip memory, and a high I/O count within an industrial temperature-rated package. Its combination of approximately 67k logic elements, roughly 4.526 Mbits of embedded RAM, and up to 490 I/Os makes it suitable for consolidating complex digital functions while maintaining a compact BGA footprint.

Engineers and procurement teams looking for a surface-mount FPGA with industrial-grade temperature capability and RoHS compliance will find this device appropriate for embedded systems, communications interfaces, and control applications that demand integration and reliability from a single Lattice Semiconductor ECP3-family device.

Request a quote or submit an inquiry to check availability and obtain pricing and lead-time information for the LFE3-70EA-9FN1156I.