LFE3-70EA-9FN672I

The LFE3-70EA-9FN672I is an industrial-grade FPGA from the Lattice ECP3 family, delivering a balance of logic density, embedded memory and flexible I/O for mid-range system integration. Built on the ECP3 architecture, it targets applications that require significant on-chip logic (67,000 logic elements), substantial embedded RAM (approximately 4.53 Mbits) and up to 380 user I/Os in a compact 672-ball BGA package.

This device is optimized for designs that need configurable high-speed interfaces, DSP resources and robust system-level support while operating across an industrial temperature range and a low-voltage core supply.

Key Features

• Logic Capacity — 67,000 logic elements and 8,375 LABs (logic array blocks) provide substantial programmable logic for complex state machines, glue logic and custom datapaths.
• Embedded Memory — Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) for deep buffering, FIFOs and embedded data structures.
• I/O Count & Flexibility — 380 user I/Os enable wide parallel interfaces and multiple peripheral connections in a single device.
• High-Speed SERDES and Interfaces — Family-level embedded SERDES support data rates shown in the ECP3 family (150 Mbps to 3.2 Gbps), enabling high-speed serial protocols and multi-channel links.
• DSP and sysDSP™ — ECP3 family DSP architecture provides cascadable slices for multiply-accumulate operations and high-performance arithmetic (family-level sysDSP details provided in the ECP3 data sheet).
• Clocking and Timing — Family-level support includes multiple PLLs and DLLs for flexible clocking and source-synchronous interfaces.
• Power — Core voltage supply range of 1.14 V to 1.26 V suitable for low-voltage core designs.
• Package & Mounting — 672-BBGA package; supplier device package listed as 672-FPBGA (27 × 27 mm). Surface-mount mounting type for PCB assembly.
• Operating Range & Compliance — Industrial operating temperature range of −40 °C to 100 °C and RoHS compliant for environmental compatibility.

Typical Applications

• High-speed data interfaces — Implement serial links and protocol bridges using the device’s family-level SERDES and abundant I/O resources for protocols requiring multi-gigabit or mid-rate serial channels.
• Signal processing and DSP — Use the ECP3 sysDSP architecture and plentiful logic elements for real-time filtering, accumulate operations and intermediate data processing.
• Memory controllers and buffering — Leverage approximately 4.53 Mbits of embedded RAM for frame buffers, FIFO staging and packet buffering in communications and embedded systems.
• Industrial control and automation — The industrial temperature rating and high I/O count make this device suitable for complex control, sensor aggregation and protocol conversion tasks.

Unique Advantages

• High logic density: 67,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
• Substantial on-chip memory: Approximately 4.53 Mbits of embedded RAM supports deep buffering and local data storage without external memory.
• Large I/O complement: 380 user I/Os permit multiple parallel interfaces and mixed-signal front-end connections on one device footprint.
• Industrial robustness: Rated for −40 °C to 100 °C operation, enabling deployment in demanding environments.
• Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with contemporary low-power system architectures.
• RoHS compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose LFE3-70EA-9FN672I?

The LFE3-70EA-9FN672I delivers a mid-range, industrial-grade FPGA option within the Lattice ECP3 family—combining tens of thousands of logic elements, multi-megabit embedded memory and hundreds of I/Os in a compact 672-ball BGA. It is well suited for engineers building high-speed interfaces, DSP pipelines, and integrated control or communications functions that benefit from on-chip memory and configurable serial/parallel I/O.

Choosing this device supports designs that require scalable logic and memory resources, industrial operating range and a family-level ecosystem of clocking, DSP and SERDES features documented in the ECP3 data materials.

If you would like pricing or availability, request a quote or submit an inquiry and our team will respond with a tailored quote and procurement options.